Abstract:
Methods and apparatus for producing a semiconductor on insulator structure include: subjecting an implantation surface of a donor single crystal semiconductor wafer to an ion implantation process to create an exfoliation layer of the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis, wherein a liquidus viscosity of the glass substrate is about 100,000 Poise or greater.
Abstract:
An alkali aluminosilicate glass that is chemically strengthened and has a down-drawable composition. The glass has a melting temperature less than about 1650° C. and a liquidus viscosity of at least 130 kpoise and, in one embodiment, greater than 250 kpoise. The glass undergoes ion exchange at relatively low temperatures to a depth of at least 30 μm.
Abstract:
A silicate glass that is tough and scratch resistant. The toughness is increased by minimizing the number of non-bridging oxygen atoms in the glass. In one embodiment, the silicate glass is an aluminoborosilicate glass in which −15 mol 1%≦(R2O+R′O—Al2O3—ZrO2)—B2O3≦4 mol %, where R is one of Li, Na, K, Rb, and Cs, and R′ is one of Mg, Ca, Sr, and Ba.
Abstract:
Computer-implemented methods and apparatus are provided for predicting/estimating chemical depth of layer (DOL) and maximum surface compressive stress (CS) of glass articles after ion-exchange. The methods and apparatus can, for example, be used to select glass compositions, salt bath temperatures, and/or ion-exchange times which provide desired DOL and/or CS values. One or more manufacturing constraints, e.g., constraints on liquidus viscosity, zircon breakdown viscosity, and the like, can be applied to the process of predicting/estimating DOL and/or CS values so that glass compositions selected based on DOL and/or CS values can, for example, be manufactured commercially by a fusion or float process.
Abstract:
Methods and apparatus for predicting viscosities of glass materials as a function of temperature and composition are provided. Two fitting parameters (fitting coefficients) are used for each of the viscosity-affecting components contained in the material. The parameters can accurately cover a wide range of temperatures (i.e., a wide range of viscosities) and a wide range of compositions. The viscosity predictions can be used as a guide for glass research as well as in feedback control systems for glass manufacturing processes. Methods and apparatus for predicting glass resistivity are also disclosed.
Abstract:
Disclosed are alkali-free glasses having a liquidus viscosity of greater than or equal to about 90,000 poises, said glass comprising SiO2, Al2O3, B2O3, MgO, CaO, and SrO such that, in mole percent on an oxide basis: 64≦SiO2≦68.2; 11≦Al2O3≦13.5; 5≦B2O3≦9; 2≦MgO≦9; 3≦CaO≦9; and 1≦SrO≦5. The glasses can be used to make a display glass substrates, such as thin film transistor (TFT) display glass substrates for use in active matrix liquid crystal display devices (AMLCDs) and other flat panel display devices.
Abstract:
Computer-implemented methods and apparatus are provided for predicting/estimating chemical depth of layer (DOL) and maximum surface compressive stress (CS) of glass articles after ion-exchange. The methods and apparatus can, for example, be used to select glass compositions, salt bath temperatures, and/or ion-exchange times which provide desired DOL and/or CS values. One or more manufacturing constraints, e.g., constraints on liquidus viscosity, zircon breakdown viscosity, and the like, can be applied to the process of predicting/estimating DOL and/or CS values so that glass compositions selected based on DOL and/or CS values can, for example, be manufactured commercially by a fusion or float process.
Abstract:
A silicate glass that is tough and scratch resistant. The toughness is increased by minimizing the number of non-bridging oxygen atoms in the glass. In one embodiment, the silicate glass is an aluminoborosilicate glass in which −15 mol %≦(R2O+R′O—Al2O3—ZrO2)—B2O3≦4 mol %, where R is one of Li, Na, K, Rb, and Cs, and R′ is one of Mg, Ca, Sr, and Ba.
Abstract:
The present disclosure relates to glass articles for use as a touchscreen substrate for use in a portable electronic device, particularly comprising an alkali-free aluminosilicate glass exhibiting a high damage threshold of at least 1000gf, as measured by the lack of the presence of median/radial cracks when a load is applied to the glass using a Vickers indenter, a scratch resistance of at least 900gf, as measured by the lack of the presence of lateral cracks when a load is applied by a moving Knoop indenter and a linear coefficient of thermal expansion (CTE) over the temperature range 0-300° C. which satisfies the relationship: 25×10−7/° C.≦CTE≦40×10−7/° C.
Abstract:
The present disclosure relates to glass articles for use as a touchscreen substrate or cover glass article for use in a portable electronic device, particularly an aluminoborosilicate glass being substantially free of alkalis, comprising at least 55 mol % SiO2, at least 5 mol % Al2O3 and at least one alkaline earth RO component. The alkali-free aluminoborosilicate exhibits an Al2O3+B2O3 to RO mol % ratio which exceeds 1 and an Al2O3 to RO mol % ratio which exceeds 0.65. The aluminoborosilicate glasses disclosed herein exhibits high damage resistance as evidenced by a Vickers median/radial crack initiation load which is greater than than 1000 gf, as well as a high scratch resistance of at least 900 gf, as measured by the lack of the presence of lateral cracks when a load is applied by a moving Knoop indenter.
Abstract translation:本公开涉及用作便携式电子设备中使用的触摸屏基板或盖玻璃制品的玻璃制品,特别是基本上不含碱的铝硼硅酸盐玻璃,其包含至少55摩尔%的SiO 2,至少5摩尔%的Al 2 O 3和 至少一种碱土金属RO组分。 无碱铝硼硅酸盐的Al 2 O 3 + B 2 O 3与RO摩尔%比超过1,Al 2 O 3与RO摩尔%比超过0.65。 本文公开的铝硼硅酸盐玻璃表现出高的耐损伤性,如通过维氏中值/径向裂纹起始载荷大于1000gf以及高至少900gf的高耐刮擦性所证明的,如通过不存在 通过运动的Knoop压头施加负载时的横向裂纹。