公开(公告)号：US20080308231A1

公开(公告)日：2008-12-18

申请号：US12138313

申请日：2008-06-12

申请人： Jae-Seob LEE ,  Jin-Ho KWACK ,  Tae-Kyung AHN

发明人： Jae-Seob LEE ,  Jin-Ho KWACK ,  Tae-Kyung AHN

IPC分类号： B32B37/06 ,  B32B37/08

CPC分类号： B32B38/10 ,  B32B37/10 ,  B32B38/0008 ,  B32B38/162 ,  B32B38/164 ,  B32B43/006 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2310/0843 ,  B32B2310/14 ,  Y10T156/1153 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/1967

摘要： A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.

摘要翻译： 公开了一种柔性基板接合和剥离装置。 在一个实施例中，该设备包括：i）室，ii）设置在室的下部中并具有下部加热单元和内置冷却管道的下卡盘，iii）设置在下卡盘上方的上卡盘， 其中内置上加热单元，iv）设置在上卡盘上方的加压单元，以及v）对应于设置在下卡盘和上卡盘之间的支撑基板和柔性基板的接合表面的任一侧的分离单元。 柔性基板接合和脱粘装置可以使用热处理工艺同时对柔性基板和支撑基板加压。 因此，即使在低温下，柔性基板也可以更可靠地结合和剥离。