公开(公告)号：US20190099921A1

公开(公告)日：2019-04-04

申请号：US16126122

申请日：2018-09-10

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Akira KANO ,  Daisuke SAKUMA ,  Keisuke ISOMURA

IPC分类号： B29B17/02

CPC分类号： B29B17/02 ,  B29B2017/0203 ,  B29B2017/0293 ,  B29K2105/12 ,  B32B38/10 ,  B32B43/006 ,  C08J11/08 ,  C08J11/16 ,  C08K7/06 ,  D01F9/12 ,  Y10T156/1116 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1961

摘要： A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

公开(公告)号：US20180319149A1

公开(公告)日：2018-11-08

申请号：US16036610

申请日：2018-07-16

申请人： Euna Park

发明人： Euna Park

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B2038/0076 ,  B32B2309/027 ,  B32B2457/208 ,  Y10S156/93 ,  Y10T156/1153 ,  Y10T156/1911

摘要： A technique for protecting a portion of a screen panel during a process for disassembling and servicing a display screen device is provided. A first part of the display screen device is separated from a screen panel part of the display screen device, where the screen panel part includes a main screen portion and a circuit of flexible printable circuit board (FPCB) portion. An encapsulant is applied onto a break protectable layer (BPL) of the circuit of flexible printable circuit board (FPCB) portion. The screen panel part is washed, with a solvent to remove residue from the main screen portion.

公开(公告)号：US20180229487A1

公开(公告)日：2018-08-16

申请号：US15750317

申请日：2015-12-18

申请人： Jiangsu Cherrity Optronics Co., Ltd

发明人： Jinhua He

IPC分类号： B32B37/00 ,  H01L33/00 ,  B32B37/08 ,  B32B37/20 ,  B32B38/00

CPC分类号： B32B37/0053 ,  B32B37/08 ,  B32B37/203 ,  B32B38/0004 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/00 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56 ,  H01L2933/005 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1174 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/195 ,  Y10T156/1956

摘要： An equipment system for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling includes a protective film removing apparatus used for removing a protective film on one side of a photoconversion sheet with protective films on both sides and a roll-bonding apparatus for packaging a flip chip LED array by using the photoconversion sheet containing a protective film on a single side, to form LED package elements. The protective film removing apparatus includes a photoconversion sheet freezing part (2-1, 2-2), a traction part for pulling and removing a protective film on a single side of the frozen photoconversion sheet, and a photoconversion sheet rewarming part (4-1, 4-2) that are sequentially connected and disposed. The roll-bonding apparatus includes two single-wheeled rollers (5-1, 5-2) whose rolling surfaces are both smooth surfaces. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a requirement of a process for bond-package an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.

公开(公告)号：US10018782B2

公开(公告)日：2018-07-10

申请号：US15148389

申请日：2016-05-06

申请人： CORNING OPTICAL COMMUNICATIONS LLC

发明人： Qi Wu

IPC分类号： B32B38/10 ,  G02B6/245 ,  B32B43/00 ,  B08B7/00

CPC分类号： G02B6/245 ,  B08B7/0007 ,  B32B38/10 ,  B32B43/006 ,  Y10T156/1153 ,  Y10T156/1911

摘要： An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater extending at least partially around and at least partially defining an elongate heating region configured for receiving the lengthwise section of the optical fiber. The heater can heat the heating region to a temperature above the thermal decomposition temperature of the at least one coating. A controller automatically deactivates the heater after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region. Thereafter, an air mover can cause ambient air to cool the heater.

公开(公告)号：US20180029210A1

公开(公告)日：2018-02-01

申请号：US15225091

申请日：2016-08-01

申请人： Sikorsky Aircraft Corporation

发明人： Scott O. Smith ,  Sven R. Lofstrom ,  Philip Petering

IPC分类号： B25B27/28 ,  C09J5/06

CPC分类号： B25B27/28 ,  B25B5/003 ,  B25B5/006 ,  B25B5/065 ,  B25B27/06 ,  B32B38/10 ,  B32B43/006 ,  C09J5/06 ,  Y10T156/1153 ,  Y10T156/1911

摘要： A cuff-blade attachment bushing removal tool system includes an alignment plate comprising alignment holes defined through the alignment plate in a pattern of a plurality of bushing holes of a blade root, a bladder plate connected to the alignment plate, and a bladder positioned on the bladder plate such that a gap is formed between the bladder and the alignment plate to receive a blade root to align the alignment holes and the bushing holes of the blade root, wherein the bladder is transitionable between an uninflated position where the blade root can be inserted into the gap and an inflated position where the blade root is clamped between the bladder and the alignment plate.

公开(公告)号：US09862115B2

公开(公告)日：2018-01-09

申请号：US14671760

申请日：2015-03-27

申请人： Intel Corporation

发明人： Denica N. Larsen ,  Wing K. Ho

IPC分类号： B29C65/02 ,  B29C65/48 ,  B32B43/00 ,  B26F3/12 ,  G06F1/16 ,  B29L31/34

CPC分类号： B26F3/12 ,  B29L2031/34 ,  G06F1/1626 ,  Y10S156/924 ,  Y10S156/937 ,  Y10T156/1153 ,  Y10T156/1911

摘要： Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

公开(公告)号：US20170133243A1

公开(公告)日：2017-05-11

申请号：US15318790

申请日：2014-06-27

申请人： Erich Thallner

发明人： Erich Thallner

IPC分类号： H01L21/67 ,  B32B43/00 ,  B32B37/08 ,  H01L21/687 ,  H01L21/683

CPC分类号： H01L21/67092 ,  B32B37/08 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/00 ,  H01L21/67103 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68714 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1972

摘要： A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by embrittlement of the interconnect layer. A method for bonding of a first substrate to a second substrate with an interconnect layer which can be embrittled by cooling. A use of a material which can be embrittled for producing an interconnect layer between first and second substrate for forming a substrate stack. A substrate stack, formed from a first substrate, a second substrate and an interconnect layer located therebetween, the interconnect layer formed from a material which can be embrittled. A wafer chuck for holding a first substrate when the first substrate is being detached from a second substrate with fixing means which can be activated by lowering the temperature.

公开(公告)号：US09629293B2

公开(公告)日：2017-04-18

申请号：US14800810

申请日：2015-07-16

申请人： BOE Technology Group Co., Ltd. ,  Beijing BOE Optoelectronics Technology Co., Ltd.

发明人： Zengqiang Zheng ,  Yixiu Liu

IPC分类号： B32B38/10 ,  H05K13/04 ,  B32B43/00 ,  G02F1/13 ,  H05K1/18 ,  H05K3/32

CPC分类号： H05K13/0491 ,  B32B43/006 ,  G02F1/13 ,  H05K1/189 ,  H05K3/323 ,  H05K2203/1105 ,  H05K2203/176 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978

摘要： Embodiments of the invention disclose a chip removing device for facilitating the removal of a chip and reducing an influence on the flexible printed circuit board caused by heat, thereby optimizing the manufacturing process of the LCD panel. The chip removing device comprises: a handle; a heat supply unit mounted at one end of the handle, a detachable chip heating head provided on one side of the heat supply unit away from the handle; and a temperature controller in signal communication with the heat supply unit for controlling a temperature output by the heat supply unit.

公开(公告)号：US09586313B2

公开(公告)日：2017-03-07

申请号：US14746481

申请日：2015-06-22

申请人： GroupeSTAHL

发明人： Benjamin Robinson ,  Rich Antoszewski

IPC分类号： B32B38/10 ,  B25H1/18 ,  B32B37/00 ,  B32B43/00 ,  A47B19/10 ,  A47B9/08 ,  B32B38/00 ,  B32B41/00

CPC分类号： B25H1/18 ,  A47B9/08 ,  A47B19/10 ,  B32B37/0046 ,  B32B38/0036 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911

摘要： The present teachings provide for a weeding table including a table portion, a clamp device, and a heating mechanism. The table portion can include a table member and a work-surface. The clamp device can include a clamp and a cylinder. The clamp can include a base fixedly coupled to the table member and an arm coupled to the base. The arm can be movable relative to the base between a first position and a second position. The cylinder can be coupled to the arm to be translated thereby such that the cylinder is a greater distance from the work-surface when the arm is in the first position than when the arm is in the second position. The cylinder can be rotatable relative to the arm about a longitudinal axis of the cylinder. The heating mechanism can be coupled to the table member and can be configured to heat the work-surface.

摘要翻译： 本教导提供了包括台部，夹紧装置和加热机构的除草台。 工作台部分可以包括工作台构件和工作表面。 夹紧装置可以包括夹具和气缸。 夹具可以包括固定地联接到工作台构件的基座和联接到基座的臂。 臂可以相对于基座在第一位置和第二位置之间移动。 气缸可以联接到臂以被平移，使得当臂处于第一位置时，当臂处于第二位置时，气缸距离工作表面更大的距离。 气缸可相对于臂围绕气缸的纵向轴线旋转。 加热机构可以联接到工作台构件并且可以构造成加热工作表面。

公开(公告)号：US09545783B2

公开(公告)日：2017-01-17

申请号：US14433365

申请日：2012-10-03

申请人： COEXPAIR

发明人： Marc Gillard ,  Andre Bertin

IPC分类号： B32B38/10 ,  B32B43/00 ,  B29B17/02 ,  B29K63/00

CPC分类号： B32B43/006 ,  B29B17/02 ,  B29B2017/0217 ,  B29B2017/0255 ,  B29K2063/00 ,  B32B38/10 ,  B32B2363/00 ,  Y02W30/622 ,  Y10T156/1126 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1195 ,  Y10T156/1911 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/195 ,  Y10T156/1978 ,  Y10T156/1994

摘要： Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin. Angle (αa) is chosen to optimize the peel-back angle of the backing sheet (240) after is passes over the release element (260) in relation to the relative spacing between the dispensing and wind-up rolls (220, 250) and the release element (260).

摘要翻译： 本文描述的是在环氧树脂的玻璃化转变温度以下的温度下从背衬片上除去环氧树脂的装置和方法。 装置（200）包括壳体（210），其中在背衬片（240）上安装包括环氧树脂（230）的分配辊（220），包括背衬片（240）的卷绕辊（250） ，背衬片（240）被引导到其上的释放元件（260）和用于收集从背衬片（240）移除的树脂（230a）的收集盘（270）。 分配卷绕辊（220,250）安装在由控制器（280）控制的驱动机构（285）驱动的相应驱动轴（225,255）上。 还提供温度控制器（290），用于控制壳体（210）内的温度，使其保持在环氧树脂的玻璃化转变温度以下或玻璃化转变温度。 选择角度（αa）以在背衬片材（240）相对于分配辊和卷绕辊（220,250）之间的相对间隔相对于剥离辊（220,250）和 释放元件（260）。