Abstract:
Provided is a light sensing pixel including an image sensor. In a general four-transistor Complementary Metal-Oxide Semiconductor (CMOS) image sensor, unlike a conventional structure, a transfer transistor in a pixel includes a depletion region separated from a channel that is not influenced by a turn-on voltage of the transfer transistor regardless of a driving voltage or a driving method when a photodiode is reset and transferred. As a result, dark current or fixed pattern noise, caused by a change in operating condition of the transfer transistor and inconsistent characteristics between the pixels, is reduced.The image sensor includes a light sensing pixel that includes the transfer transistor for transferring a light-induced charge generated by the photodiode. The light sensing pixel, to dispose the depletion region between the channel of the transfer transistor and a diffusion node, i.e., to operate in the similar pinch-off state, may have a structure in which an insulating layer of the diffusion node side is thicker than a gate insulating layer adjacent to the photodiode in the transfer transistor. That is, the insulating layer of the transfer transistor has steps or a gradual change in thickness. Also, the light sensing pixel may have a structure in which pocket/halo implant using electrically the same material as a doping material of a substrate is performed between the channel of the transfer transistor and the diffusion node.
Abstract:
The present invention relates to a method of controlling the microstructures of Cu—Cr-based contact materials for vacuum interrupters, in which a heat-resistant element is added to the Cu—Cr-based contact materials to obtain an excellent current interrupting characteristic and voltage withstanding capability, and contact materials manufactured thereby. The method of controlling the microstructures of Cu—Cr-based contact materials includes the steps of mixing a copper powder used as a matrix material, a chromium powder improving an electrical characteristic of the contact material and a heat-resistant element powder making the chromium particles in the matrix material fine to thereby obtain mixed powder, and subjecting the mixed powder to one treatment selected from sintering, infiltration and hot pressing to thereby obtain a sintered product.