公开(公告)号：US20150348994A1

公开(公告)日：2015-12-03

申请号：US14469554

申请日：2014-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chao Liu ,  Yujun Zhang ,  Zengsheng He ,  Lei Chen

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1259

Abstract: This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.

Abstract translation: 本公开涉及阵列基板布线及其制造和修理方法。 阵列基板布线包括形成在基板上用于传输电信号的第一布线; 形成在所述第一布线上的绝缘层; 形成在绝缘层上的与第一布线相对的第二布线，第二布线处于挂起状态，不发送电信号。 通过这样的双层布线结构，使用上层中的第二布线来阻止在绝缘层中产生的孔，使得外部水分不能经由绝缘层中的孔到达第一布线，从而保护第一 用于从腐蚀和划痕传输电信号的接线。