Abstract:
A circuit board module and a forming method thereof are provided. The circuit board module includes a first circuit board, a second circuit board and a conductive structure. The first circuit board has a first surface, a second surface and an opening. The opening passes through the first surface and the second surface. The first surface has a first solder pad. The second circuit board has a second solder pad. Part of the second circuit board passes through the opening from the first surface to the second surface, so that part of the second solder pad is exposed on the first surface. The conductive structure is electrically connected to the first solder pad and the second solder pad, so that the first circuit board is electrically connected to the second circuit board.
Abstract:
A backlight assembly includes a frame, a light source, and at least one optical film. The light source is disposed on the frame. The optical film has at least one positioning flange. The frame has a first, a second and a third member to form a polygonal accommodating area and is adapted to receive the optical film. First and second containing regions are positioned adjacent to a place which the third member is connected to the first member and the third member is connected to the second member, respectively. The first containing region projects into the first and third members, and the second containing region projects into the second and third members, so that the first containing region and the second containing region are adapted to receive the shaped positioning flange of the optical film.
Abstract:
A display module includes components of a display panel having an outward first FPC for connecting to a system, wherein the first FPC has a foldable part Qn which a welding area is defined, and a backlight unit opposite to the display panel for providing illumination for the display panel. The backlight unit has an outward second FPC which is welded with the welding area of the foldable part. Both the foldable part and second FPC are folded and turned around to keep the welding area attach to the backside of the backlight unit.
Abstract:
A backlight module is provided. The backlight module includes a frame, a light source and at least an optical film. The optical film has a first side with a first positioning flange and a second positioning flange, a second side with a third positioning flange and a third side with a fourth positioning flange. The edges of the first positioning flange, the second positioning flange, the third positioning flange and the fourth positioning flange abut the edges of the frame to hold the optical film in the frame.
Abstract:
A backlight assembly includes a frame, a light source, and at least one optical film. The light source is disposed on the frame. The optical film has at least one positioning flange. The positioning flange includes at least two contact edges configured to abut against at least one edge of the frame in at least two directions to hold the optical film in place relative to the frame.
Abstract:
Organic light emitting diode (OLED) devices with heat dissipation elements for electronic devices. The OLED devices comprise an OLED module and a frame enclosing the OLED module, wherein the frame comprises an exposing portion to outside the electronic device.
Abstract:
An electronic device with flexible printed circuit board structure. The electronic device includes a first flexible printed circuit board and a second flexible printed circuit board. The first flexible printed circuit board has a first bent portion. The second flexible printed circuit board has a second bent portion penetrating the first bent portion as the first and the second flexible printed circuit boards are bent simultaneously.