公开(公告)号：USD911564S1

公开(公告)日：2021-02-23

申请号：US29677518

申请日：2019-01-22

Applicant: Cheng-Yu Wang

Designer： Cheng-Yu Wang

公开(公告)号：US08760862B2

公开(公告)日：2014-06-24

申请号：US13343882

申请日：2012-01-05

Applicant: Cheng-Yu Wang

Inventor： Cheng-Yu Wang

IPC: H05K7/20

CPC classification number: G06F1/203

Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.

Abstract translation: 公开了一种包括壳体，电路板，风扇和散热装置的便携式电子设备。 电路板设置在壳体中并且在其上包括至少一个电子部件。 风扇设置在外壳中。 散热装置设置在壳体中并靠近风扇的出风口侧。 在散热装置的外表面和壳体的内表面之间形成的间隙作为气流通道。 便携式电子设备通过间隙隔离传导到便携式电子设备的壳体的热量。

公开(公告)号：US20130163279A1

公开(公告)日：2013-06-27

申请号：US13471435

申请日：2012-05-14

Applicant: Ci-Guang Peng ,  Cheng-Yu Wang ,  Chung-Yang Hung ,  Te-Hen Lo ,  Cheng-Min Tsai ,  Ming-Sheng Lai ,  Ren-Wei Huang ,  Shu-Ting Jhuang

Inventor： Ci-Guang Peng ,  Cheng-Yu Wang ,  Chung-Yang Hung ,  Te-Hen Lo ,  Cheng-Min Tsai ,  Ming-Sheng Lai ,  Ren-Wei Huang ,  Shu-Ting Jhuang

IPC: F21V7/04 ,  F21V8/00

CPC classification number: F21V7/04 ,  G02B6/0011 ,  G02B6/002

Abstract: A backlight module including a light guide plate and a light source is provided. The light guide plate has a light incident surface, a light reflection surface, a first side surface and a second side surface. The light incident surface is connected to the second side surface. The reflection surface is connected between the first side surface and the light incident surface. The first and the second side surfaces are two planes with their extending planes intersected. The light incident surface is a chamfering plane connected between the first and the second side surfaces. The light reflection surface is a cambered surface connected between the first side surface and the light incident surface. The light source is disposed next to the light incident surface, so as to transmit light into the light guide plate through the light incident surface.

Abstract translation: 提供了包括导光板和光源的背光模块。 导光板具有光入射面，光反射面，第一侧面和第二侧面。 光入射表面连接到第二侧表面。 反射面连接在第一侧面和光入射面之间。 第一和第二侧表面是两个平面，它们的延伸平面相交。 光入射表面是连接在第一和第二侧表面之间的倒角平面。 光反射表面是连接在第一侧表面和光入射表面之间的弧形表面。 光源设置在光入射表面附近，以便通过光入射表面将光透射到导光板中。

公开(公告)号：USD682715S1

公开(公告)日：2013-05-21

申请号：US29441749

申请日：2013-01-09

Applicant: Cheng-Yu Wang

Designer： Cheng-Yu Wang

公开(公告)号：US20120051008A1

公开(公告)日：2012-03-01

申请号：US12873315

申请日：2010-08-31

Applicant: Cheng-Yu Wang ,  Chang-Hsu Yen

Inventor： Cheng-Yu Wang ,  Chang-Hsu Yen

IPC: H05K5/00 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K1/0201 ,  G06F1/1658 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09854

Abstract: A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.

Abstract translation: 电路板包括主体，电子部件，固定部分和至少一个通孔。 电子部件和固定部分设置在主体上。 所述至少一个通孔形成在所述主体上并与所述固定部分相邻。

公开(公告)号：US07191822B2

公开(公告)日：2007-03-20

申请号：US11105466

申请日：2005-04-14

Applicant: Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang ,  Jim-Fat Tseng

Inventor： Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang ,  Jim-Fat Tseng

IPC: F28F13/00

CPC classification number: H01L23/3672 ,  F28F3/02 ,  F28F2265/28 ,  H01L21/4878 ,  H01L23/467 ,  H01L2924/0002 ,  Y10S165/529 ,  H01L2924/00

Abstract: An aluminum extruded fin set includes a substrate and a plurality of dissipation fins mounted upright on it. There are gaps between heat dissipation fins. Each dissipation fin is divided into three child dissipation fins by two slanted cutouts. The child dissipation fin between two slanted cutouts is bent toward the gap between heat dissipation fins. When airflow passes by the gaps, the airflow velocity distribution is modified due to the bent child dissipation fins and the noise spectrum distribution is modified as well. Such a Hay-stack noise spectrum distribution is more comfortable for the listener than a conventional one.

Abstract translation: 铝挤压翅片组包括基板和直立安装在其上的多个散热片。 散热片之间有间隙。 每个耗散翅片由两个倾斜的切口分成三个儿童散热片。 两个倾斜切口之间的儿童散热片朝向散热鳍片之间的间隙弯曲。 当气流通过间隙时，气流速度分布由于弯曲的儿童散热片而改变，噪声谱分布也被改变。 这种干草堆噪声频谱分布对于听众而言比常规音乐分布更舒适。

公开(公告)号：US20060238981A1

公开(公告)日：2006-10-26

申请号：US11189496

申请日：2005-07-26

Applicant: Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang ,  Jim-Fat Tseng ,  Tsan-Nan Chien ,  Yu Liu

Inventor： Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang ,  Jim-Fat Tseng ,  Tsan-Nan Chien ,  Yu Liu

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.

Abstract translation: 本发明提供一种散热装置及其散热方法。 电子设备包括热源，与热源接触的热界面材料（TIM），与热界面材料接触的散热模块，以及将散热模块推向热源的弹性部件。 弹性构件包括基部和从基部延伸的可压缩部分，由此施加到可压缩部分的力被传递并均匀分布在基部上。 散热方法包括将热界面材料和散热模块重叠在热源上的步骤，并向散热模块施加朝向热源的力。

公开(公告)号：US20050259398A1

公开(公告)日：2005-11-24

申请号：US11045303

申请日：2005-01-31

Applicant: Dennis Liu ,  Tsan-Nan Chien ,  Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang

Inventor： Dennis Liu ,  Tsan-Nan Chien ,  Yu-Nien Huang ,  Shun-Ta Yu ,  Cheng-Yu Wang

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect. The extended heat-dissipation module is in the main heat-dissipation module when the heat amount generated by an electronic device is normal. The extended heat-dissipation module extends out from the main heat-dissipation module to increase the heat convection area when the heat amount generated by the electronic device is large.

Abstract translation: 扩展翅片阵列具有主散热模块和扩展散热模块。 主要散热模块和扩展散热模块堆叠，以增加有效对流面积，增加散热效果。 当由电子设备产生的热量正常时，扩展散热模块在主散热模块中。 扩散散热模块从主散热模块延伸出来，当电子设备产生的热量大时，增加热对流面积。