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公开(公告)号:US4297647A
公开(公告)日:1981-10-27
申请号:US48849
申请日:1979-06-15
IPC分类号: H01P3/08 , H01L23/498 , H01L25/16 , H03F3/195 , H03F3/20 , H03F3/213 , H05K1/03 , H05K1/16 , H03F3/14 , H05K5/02
CPC分类号: H01L25/16 , H01L23/49811 , H03F3/195 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K1/165
摘要: A hybrid integrated circuit for high output power having a conductive pattern on a ceramic substrate, a lead frame connected to said pattern, and electronic components mounted on said pattern wired with one another, has been found. When said conductive pattern has an inductor in a spiral shape, the same spiral pattern is conformed on the lead frame, and those two spiral patterns are overlapped. Thus, the resistance of the inductor is reduced since the conductive pattern and the lead frame pattern are connected parallel to each other. Then, a large current can be loaded to said inductance with only a small loss. As the material of the lead frame is cheap, the resultant hybrid integrated circuit can be manufactured at a lower cost.
摘要翻译: 已经发现了一种用于高输出功率的混合集成电路,其具有在陶瓷衬底上的导电图案,连接到所述图案的引线框架和安装在彼此布线的所述图案上的电子部件。 当所述导电图案具有螺旋形状的电感器时,在引线框架上形成相同的螺旋图案,并且这两个螺旋图案重叠。 因此,由于导电图案和引线框架图案彼此平行地连接,所以电感器的电阻减小。 然后,只有很小的损耗可以将大电流加载到所述电感。 由于引线框架的材料便宜,所以可以以较低的成本制造所得到的混合集成电路。