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公开(公告)号：US5697748A
公开(公告)日：1997-12-16
申请号：US205711
申请日：1994-03-03
IPC分类号： H01L21/677 , H01L21/683 , B65G65/00
CPC分类号： H01L21/67748 , H01L21/67739 , H01L21/6838 , Y10S414/137
摘要： A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.
摘要翻译： 用于从晶片存储盒处理晶片的半导体晶片处理系统包括：晶片传送室; 传送室内的晶片存储电梯; 一个或多个晶片处理室; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。 当从外部接收晶片时，储存室压力在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。 传送装置包括机器人臂; 在所述机器人臂的前端处的薄平板晶片承载叶片，其被配置用于从所述存储盒或电梯接合晶片; 以及晶片支撑托盘，其构造成用于与所述刀片可拆卸地接合并且用于从所述电梯或处理腔室内的支撑座接合和积极地定位晶片。 当传送装置在真空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并有助于在运输过程中保持晶片。 当晶片在大气压下在盒和电梯之间转移时，托盘与叶片脱离并放置在电梯上的静止位置，并且通过单独的叶片执行晶片传送，该真空拾取器与叶片成一整体 。 叶片包括一起限定真空通道和电容位置传感器的上半部和下半部。
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公开(公告)号：US5636964A
公开(公告)日：1997-06-10
申请号：US438670
申请日：1995-05-10
IPC分类号： B65G49/07 , H01L21/677 , H01L21/683 , B65G65/00
CPC分类号： H01L21/6838 , H01L21/67742 , H01L21/67748 , Y10S294/907 , Y10S414/137 , Y10S414/139 , Y10S414/141
摘要： A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated enviroment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.
摘要翻译： 用于从晶片存储盒处理晶片的半导体晶片处理系统包括：晶片传送室; 传送室内的晶片存储电梯; 一个或多个晶片处理室; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。 当从外部接收晶片时，储存室压力在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。 传送装置包括机器人臂; 在所述机器人臂的前端处的薄平板晶片承载叶片，其被配置用于从所述存储盒或电梯接合晶片; 以及晶片支撑托盘，其构造成用于与所述刀片可拆卸地接合并且用于从所述电梯或处理腔室内的支撑座接合和积极地定位晶片。 当传送装置在电梯和处理室之间移动晶片在真空环境中时，托盘与刀片接合并有助于在运输过程中保持晶片。 当晶片在大气压下在盒和电梯之间转移时，托盘与叶片脱离并放置在电梯上的静止位置，并且通过单独的叶片执行晶片传送，该真空拾取器与叶片成一整体 。 叶片包括一起限定真空通道和电容位置传感器的上半部和下半部。
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公开(公告)号：US5556147A
公开(公告)日：1996-09-17
申请号：US438328
申请日：1995-05-10
IPC分类号： B65G49/07 , H01L21/677 , H01L21/683 , B25J15/06
CPC分类号： H01L21/6838 , H01L21/67742 , H01L21/67748 , Y10S294/907 , Y10S414/137 , Y10S414/139 , Y10S414/141
摘要： A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray which is configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.
摘要翻译： 用于从晶片存储盒处理晶片的半导体晶片处理系统包括：晶片传送室; 传送室内的晶片存储电梯; 一个或多个晶片处理室; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。 当从外部接收晶片时，储存室的环境在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。 传送装置包括机器人臂; 在所述机器人臂的前端处的薄平板晶片承载叶片，并且构造成用于从所述存储盒或电梯接合晶片; 以及晶片支撑托盘，其构造成用于与所述刀片可移除接合，并且用于接合并且将来自所述升降机的晶片或将处理室内的支撑基座正确地定位。 当传送装置在真空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并有助于在运输过程中保持晶片。 当晶片在大气压下在盒和电梯之间转移时，托盘与叶片脱离并放置在电梯上的静止位置，并且通过单独的叶片执行晶片传送，该真空拾取器与叶片成一整体 。 叶片包括一起限定真空通道和电容位置传感器的上半部和下半部。
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44.发明授权Method and apparatus for preventing cross contamination of species during the processing of semiconductor wafers 失效在半导体晶片加工过程中防止物种交叉污染的方法和装置
公开(公告)号：US4937206A
公开(公告)日：1990-06-26
申请号：US377692
申请日：1989-07-10
申请人： Peter R. Jaffe , Kevin Fairbairn
发明人： Peter R. Jaffe , Kevin Fairbairn
IPC分类号： H01J37/20 , H01J37/317 , H01L21/265 , H01L21/266 , H01L21/302
CPC分类号： H01L21/302 , H01L21/265 , Y10S148/083 , Y10S438/905 , Y10S438/908 , Y10T29/41
摘要： A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the wafer while it is engaged with the support member, and removing the process compatible material from the support assembly after said material is considered to be contaminated. A shield particularly adapted for this process includes a shield portion made from a process compatible material and a process-compatible adhesive for attaching the shield portion to the support assembly.
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