公开(公告)号：US20240222153A1

公开(公告)日：2024-07-04

申请号：US18394068

申请日：2023-12-22

申请人： SEMES CO., LTD.

发明人： Joonhwan Jang ,  Soonkab Kwon ,  Hyoju Lee

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67028 ,  H01L21/67109 ,  H01L21/67739

摘要： Provided is a substrate processing apparatus including a substrate processing unit including a support member configured to support a substrate, an entrance on one side of the substrate processing unit configured to allow the substrate to enter and exit the substrate processing unit, and a housing configured to accommodate the substrate, and a first blowing member configured to supply air, wherein the first blowing member includes a fan housing with an open top and an open bottom, a fan arranged inside the fan housing and configured to flow air from the open top to the open bottom of the fan housing, a pair of first heaters arranged spaced apart from each other in a first horizontal direction with the fan therebetween and configured to supply heat.

公开(公告)号：US12014897B2

公开(公告)日：2024-06-18

申请号：US17373921

申请日：2021-07-13

申请人： Hitachi High-Tech Corporation

发明人： Akira Nishioka ,  Shuichi Nakagawa ,  Masaki Mizuochi ,  Takaaki Kikuchi ,  Masashi Fujita ,  Kenta Nomura ,  Naoya Ishigaki

IPC分类号： H01J37/26 ,  H01J37/34 ,  H01L21/677 ,  H05K7/20

CPC分类号： H01J37/261 ,  H01J37/3497 ,  H01L21/67739 ,  H05K7/20

摘要： A semiconductor processing apparatus according to the present invention includes a main body cover that covers a main body device and a control device. The main body cover has a transfer opening for transferring a semiconductor, and the main body cover further has an intake port that generates an air flow in a horizontal direction inside the main body cover.

公开(公告)号：US11941105B2

公开(公告)日：2024-03-26

申请号：US17256292

申请日：2019-04-26

申请人： SCREEN HOLDINGS CO., LTD.

发明人： Shinichi Ogasawara ,  Shoji Kirita

IPC分类号： G06F21/00 ,  G06F21/35 ,  G06F21/44 ,  H01L21/67 ,  H01L21/677 ,  H04W4/80

CPC分类号： G06F21/44 ,  G06F21/35 ,  H01L21/67248 ,  H01L21/67739 ,  H04W4/80

摘要： Authentication information is acquired from a storage medium through near field communication in one authentication device. Whether the authentication information corresponds to one substrate processing apparatus at which the authentication device is provided is determined. In a case where the authentication information corresponds to the one substrate processing apparatus, access information is transmitted from the authentication device through near field communication. An instruction terminal receives the access information through near field communication. The instruction terminal accesses a maintenance instruction device based on the access information, whereby a maintenance screen is displayed on a display of the instruction terminal. The instruction terminal has an operation unit to be operated by a user in order to provide an instruction for performing a maintenance operation.

公开(公告)号：US11921428B2

公开(公告)日：2024-03-05

申请号：US17680396

申请日：2022-02-25

申请人： KIOXIA CORPORATION

发明人： Yoshihiro Uozumi ,  Shinsuke Kimura ,  Yoshihiro Ogawa ,  Hiroyasu Iimori ,  Tatsuhiko Koide ,  Hideaki Hirabayashi ,  Yuji Nagashima

IPC分类号： G03F7/40 ,  G03F7/16 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC分类号： G03F7/405 ,  G03F7/162 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67098 ,  H01L21/6715 ,  H01L21/67739 ,  H01L21/68

摘要： According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

公开(公告)号：US11908710B2

公开(公告)日：2024-02-20

申请号：US17520826

申请日：2021-11-08

申请人： SEMES CO., LTD.

发明人： Jin Woo Jung ,  Do Hyeon Yoon ,  Yong Hee Lee

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC分类号： H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

摘要： A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US11841343B2

公开(公告)日：2023-12-12

申请号：US17682436

申请日：2022-02-28

申请人： KOKUSAI ELECTRIC CORPORATION

发明人： Teruo Yoshino ,  Naofumi Ohashi ,  Toshiro Koshimaki

IPC分类号： H04R1/08 ,  C23C16/458 ,  H01L21/677 ,  G01N29/14 ,  G01M99/00 ,  H01L21/67

CPC分类号： G01N29/14 ,  C23C16/4583 ,  G01M99/005 ,  H01L21/67739 ,  H04R1/08 ,  H01L21/67259 ,  H01L21/67793

摘要： There is provided a technique that includes abnormality detecting by picking up a sound generated from a transfer configured to be capable of transporting the substrate and comparing a waveform of sound data with a preset threshold value to detect an abnormality of the transfer; and failure detecting by picking up vibration of the transfer and comparing a waveform of vibration data with a preset threshold value to detect a failure of the transfer.

公开(公告)号：US11749549B2

公开(公告)日：2023-09-05

申请号：US16748834

申请日：2020-01-22

申请人： KCTECH CO., LTD.

发明人： Dong Min Kim

IPC分类号： H01L21/677 ,  C23C16/44 ,  H01L21/67 ,  B24B57/02 ,  B05C11/06 ,  B05D3/04

CPC分类号： H01L21/67739 ,  B05C11/06 ,  B24B57/02 ,  C23C16/4412 ,  H01L21/6719 ,  B05D3/04 ,  H01L21/67051 ,  Y10S55/29 ,  Y10S414/139

摘要： The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open. The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.

公开(公告)号：US11721583B2

公开(公告)日：2023-08-08

申请号：US16989746

申请日：2020-08-10

申请人： Applied Materials, Inc.

发明人： Sriskantharajah Thirunavukarasu ,  Karthik Balakrishnan ,  Karthik Elumalai ,  Eng Sheng Peh

IPC分类号： H01L21/78 ,  H01L21/673 ,  H01L21/677 ,  B23K26/364 ,  H01L23/544 ,  B23K101/40

CPC分类号： H01L21/78 ,  B23K26/364 ,  H01L21/673 ,  H01L21/67739 ,  H01L23/544 ,  B23K2101/40 ,  H01L2223/5446

摘要： In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

公开(公告)号：US11682565B2

公开(公告)日：2023-06-20

申请号：US17393468

申请日：2021-08-04

申请人： Ichor Systems, Inc.

发明人： Philip Ryan Barros ,  Greg Patrick Mulligan ,  Chris Melcer

IPC分类号： H01J37/32 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67017 ,  H01J37/32449 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67739

摘要： An improved fluid delivery system and method that directly controls the concentration of constituent components in a fluid mixture delivered, for example, to a process chamber. Pressure of the fluid mixture can also be directly controlled. A concentration sensor capable of measuring concentration of all of the constituent components in a fluid mixture is used to provide signals used to vary the flow rate of constituent gases under a closed loop feedback system. The signal output of one or more pressure sensors can also be used to provide a signal used to vary the flow rate of constituent gases under a closed loop feedback system. By directly controlling these two extremely important process variables, embodiments of the present invention provide a significant advantage in measurement accuracy over the prior art, enable real-time process control, reduce system level response time, and allow for a system with a significant footprint reduction.

公开(公告)号：US20190237307A1

公开(公告)日：2019-08-01

申请号：US16259189

申请日：2019-01-28

申请人： TOKYO ELECTRON LIMITED

发明人： Yasuharu SASAKI

IPC分类号： H01J37/32 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01J37/32715 ,  H01J37/32192 ,  H01L21/67103 ,  H01L21/67739 ,  H01L21/6833

摘要： A support table according to an embodiment includes a base and a support. The support is provided on the base. The support has a main body and a conductive film. The main body is formed of a dielectric material. The body has a surface region and a rear surface. The surface region is a region that is in contact with a rear surface of the substrate placed on the support. The rear surface is a surface opposite to the surface region. The rear surface of the support is bonded to the base. The conductive film is spaced apart from the surface region, and has an undulation. The surface region extends along the conductive film.