公开(公告)号：US07365987B2

公开(公告)日：2008-04-29

申请号：US11338648

申请日：2006-01-25

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: H05K7/20

CPC classification number: H05K5/02 ,  H01L2924/0002 ,  H05K7/20963 ,  H01L2924/00

Abstract: A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° from an imaginary horizontal plane.

Abstract translation: 一种具有安装在其上的第一IC芯片的电路板，以及第一散热器，其具有设置成与第一IC芯片的表面接触并具有多个散热翅片的基部，其中散热翅片远离 并且以与假想水平面成90°的角度倾斜。

公开(公告)号：US20070279326A1

公开(公告)日：2007-12-06

申请号：US11735032

申请日：2007-04-13

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: G09G3/28

CPC classification number: H05K5/02 ,  G09G3/28

Abstract: A plasma display panel device including a plasma display panel forming an image, a plurality of fixing devices attached to the rear of the plasma display panel via an adhesive member, a plurality of board units applying an electrical signal to patterned discharge electrodes in the plasma display panel, and a case accommodating the plasma display panel and the board units.

Abstract translation: 一种等离子体显示面板装置，其包括形成图像的等离子体显示面板，经由粘合部件附着到等离子体显示面板的后方的多个固定装置，对等离子体显示器中的图案化放电电极施加电信号的多个基板单元 面板和容纳等离子体显示面板和基板单元的壳体。

公开(公告)号：US20070108909A1

公开(公告)日：2007-05-17

申请号：US11594754

申请日：2006-11-09

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: H01J17/02 ,  H01J61/02

CPC classification number: H05K5/02

Abstract: A plasma display module including a chassis base having a grounding area, a plasma display panel attached to the chassis base, a circuit board configured to supply driving signals to the plasma display panel, a first driving cable connecting the circuit board to the plasma display panel, and a second driving cable having a first end connected to the plasma display panel and a second end connected to a rear surface of the plasma display panel, the second driving cable forms a substantially round curve between the first end and the second end, and the substantially round curve contacts and is grounded to the grounding area of the chassis base.

Abstract translation: 一种等离子体显示模块，包括具有接地区域的底架，附接到底座的等离子体显示面板，配置成向等离子体显示面板提供驱动信号的电路板，将电路板连接到等离子体显示面板的第一驱动电缆 以及第二驱动电缆，其具有连接到等离子体显示面板的第一端和连接到等离子体显示面板的后表面的第二端，第二驱动电缆在第一端和第二端之间形成基本圆形的曲线，以及 基本圆形的曲线接触并接地到底盘的接地区域。

公开(公告)号：US20070054524A1

公开(公告)日：2007-03-08

申请号：US11515324

申请日：2006-09-01

Applicant: Hyun-Ye Lee ,  In-Soo Cho ,  Tae-Sin Hwang ,  Hyuk Kim ,  Dong-Hyok Shin ,  Ik-Sang Lee ,  Sung-Won Bae ,  Yeung-Ki Kim ,  Gun-Gue Park ,  Kwang-Jin Jeong

Inventor： Hyun-Ye Lee ,  In-Soo Cho ,  Tae-Sin Hwang ,  Hyuk Kim ,  Dong-Hyok Shin ,  Ik-Sang Lee ,  Sung-Won Bae ,  Yeung-Ki Kim ,  Gun-Gue Park ,  Kwang-Jin Jeong

IPC: H01R13/62

CPC classification number: B65D81/053 ,  B65D81/02 ,  B65D2585/6837

Abstract: A packing assembly for display modules is disclosed. The packing assembly includes a plurality of display modules and a plurality of packing modules stacked on top of one another, each packing module comprises: a seating unit where at least one display module is seated and a first frame unit that surrounds at least a portion of the display module. According to one embodiment, the packing assembly can reduce transportation costs of the display modules by increasing the stacking rate of the display modules.

Abstract translation: 公开了一种用于显示模块的包装组件。 包装组件包括多个显示模块和堆叠在彼此之上的多个包装模块，每个包装模块包括：一个座位单元，其中至少一个显示模块就座，第一框架单元围绕至少一部分 显示模块。 根据一个实施例，包装组件可以通过增加显示模块的堆叠速率来降低显示模块的运输成本。

公开(公告)号：US20060275965A1

公开(公告)日：2006-12-07

申请号：US11435288

申请日：2006-05-17

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: H01L21/84 ,  H01L31/113

CPC classification number: H05K7/20963

Abstract: A plasma display device comprises: a plasma display panel for displaying an image; a chassis base mounted on a rear surface of the plasma display panel; a driving circuit unit mounted on a surface of the chassis base opposite to the plasma display panel; a signal transmitting device which electrically connects the driving circuit unit to the plasma display panel, and which has driving chips mounted on at least a portion thereof; and a protective plate which is fixed to the chassis base to protect the signal transmitting device, and which includes a plurality of heat sinks. The heat sinks uniformly cool driving chips mounted on at least one signal transmitting device. The heat dissipating efficiency of a heat sink located at a center of the protective plate is higher than that of a heat sink located at an edge of the protective plate.

Abstract translation: 等离子体显示装置包括：用于显示图像的等离子体显示面板; 安装在所述等离子体显示面板的后表面上的底架; 驱动电路单元，安装在与等离子体显示面板相对的底座的表面上; 信号发送装置，其将驱动电路单元电连接到等离子体显示面板，并且具有安装在其至少一部分上的驱动芯片; 以及保护板，其固定到底架以保护信号传输装置，并且包括多个散热器。 散热器均匀地冷却安装在至少一个信号传输装置上的驱动芯片。 位于保护板中心的散热器的散热效率高于位于保护板边缘的散热片的散热效率。

公开(公告)号：US20060245167A1

公开(公告)日：2006-11-02

申请号：US11404851

申请日：2006-04-17

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: H05K7/20

CPC classification number: H05K5/02 ,  H05K7/20963

Abstract: A heat dissipating structure for IC chip of a plasma display module, and a plasma display module having the same with improved the heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

Abstract translation: 等离子体显示模块的IC芯片的散热结构以及等离子体显示模块具有改善IC芯片的散热性能，同时防止从散热片散发的异物扩散。 该结构包括：底架，其包括底盘弯曲部和底座，IC芯片与底盘弯曲部接触并与信号传递部件连接，盖板配置在底盘弯曲部上并与IC芯片相对， 布置在IC芯片和盖板之间的散热片，由石墨制成的芯片散热板和还布置在IC芯片和盖板之间的导热构件，导热构件适于接触和覆盖芯片热 散纸

公开(公告)号：US20060187642A1

公开(公告)日：2006-08-24

申请号：US11338648

申请日：2006-01-25

Applicant: Kwang-Jin Jeong

Inventor： Kwang-Jin Jeong

IPC: H05K7/20

CPC classification number: H05K5/02 ,  H01L2924/0002 ,  H05K7/20963 ,  H01L2924/00

Abstract: A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° from an imaginary horizontal plane.

Abstract translation: 一种具有安装在其上的第一IC芯片的电路板，以及第一散热器，其具有设置成与第一IC芯片的表面接触并具有多个散热翅片的基部，其中散热翅片远离 并且以与假想水平面成90°的角度倾斜。