公开(公告)号：US20170284882A1

公开(公告)日：2017-10-05

申请号：US15276617

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.