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公开(公告)号：US20140374859A1
公开(公告)日：2014-12-25
申请号：US14376945
申请日：2013-02-26
Applicant: OMRON Corporation
Inventor： Takashi Kasai
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0064 , B81B2201/0257 , B81B2201/0292 , B81B2207/115 , B81C1/00246 , H04R1/04 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/006
Abstract: A sensor device has a substrate, a sensor section provided on an upper surface of the substrate, a circuit section provided on the upper surface of the substrate, a plurality of connection pads that electrically conduct with the sensor section or the circuit section, and a metal protective film covering at least a part of the circuit section from above.
Abstract translation: 传感器装置具有衬底，设置在衬底的上表面上的传感器部分，设置在衬底的上表面上的电路部分，与传感器部分或电路部分导电的多个连接焊盘，以及 金属保护膜从上方覆盖电路部分的至少一部分。
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公开(公告)号：US20140367811A1
公开(公告)日：2014-12-18
申请号：US14373547
申请日：2012-11-14
Applicant: OMRON Corporation
Inventor： Yusuke Nakagawa , Takashi Kasai , Yoshitaka Tatara
CPC classification number: B81B3/0021 , B81B3/0056 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , G01H11/06 , G01L9/12 , H04R19/005 , H04R19/04 , H04R31/00
Abstract: A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film.
Abstract translation: 电容式传感器具有具有垂直开口的通孔的半导体基板，布置在贯通孔的上方的可动电极膜，使得周边部分与设置有间隙的半导体基板的上表面相对，并且设置在上方的固定电极膜 相对于可动电极膜具有间隙的可动电极膜。 在半导体衬底的顶表面与可动电极膜的周边部分重叠的区域中，在半导体衬底的顶表面中设置至少部分由倾斜表面形成的凹部。
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