公开(公告)号：US20240348958A1

公开(公告)日：2024-10-17

申请号：US18299998

申请日：2023-04-13

Applicant: Harman International Industries, Incorporated

Inventor： Todd S. WELTI ,  Christian Manuel GARCIA

IPC: H04R1/04

CPC classification number: H04R1/04

Abstract: An insert for headphone measurements on a head-shape fixture includes a body and a coupler. The body is configured to engage at least a portion of the headphones. The body also defines an opening that is configured to receive a pinna on the head-shape fixture. The body has a variable stiffness. The coupler attaches the body to the head-shape fixture.

公开(公告)号：US12108204B2

公开(公告)日：2024-10-01

申请号：US17566129

申请日：2021-12-30

Applicant: Knowles Electronics, LLC

Inventor： Alexander Grossman ,  Janice LoPresti ,  Usha Murthy

IPC: H04R1/28 ,  H04R1/04 ,  H04R19/04

CPC classification number: H04R1/2823 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.

公开(公告)号：US12106752B2

公开(公告)日：2024-10-01

申请号：US17414934

申请日：2019-12-20

Applicant: NURA HOLDINGS PTY LTD

Inventor： Luke John Campbell ,  Dragan Petrovic

IPC: G10L15/187 ,  G10L15/22 ,  G10L15/28 ,  H04R1/04 ,  H04R1/40 ,  H04R3/00

CPC classification number: G10L15/187 ,  G10L15/22 ,  G10L15/28 ,  H04R1/04 ,  H04R1/406 ,  H04R3/005

Abstract: Introduced here are systems and methods to increase accuracy of speech recognition by utilizing multiple sensors placed at multiple speech transmission regions such as a user's lips, throat, ear canal, etc. The various speech transmission regions are better at transmitting certain phonemes, and a sensor placed close to a particular speech transition region can more accurately detect the phoneme transmitted through the particular speech transmission region. For example, a microphone placed close to the lips can better detect labial phonemes such as m, n, p, and b, than a microphone placed close to the throat. Further, disclosed here are ways to reduce energy consumption while performing speech recognition.

公开(公告)号：US12096188B2

公开(公告)日：2024-09-17

申请号：US18326921

申请日：2023-05-31

Applicant: TEAC CORPORATION

Inventor： Takuya Yoshimoto ,  Taishi Toyono

IPC: H04R3/00 ,  H04R1/04 ,  H04R5/027 ,  H04R29/00 ,  H04S1/00

CPC classification number: H04R3/005 ,  H04R1/04 ,  H04R5/027 ,  H04R29/005 ,  H04S1/007 ,  H04S2400/15

Abstract: There is disclosed an audio recorder that automatically determines, when preset microphones are configured to be detachable and different microphones are attached to the same jacks, whether or not the different microphones are in-house microphones, and automatically determines which of the X-Y technique or the A-B technique is used as the attachment technique. Holders in the audio recorder include a switch structure in which, in cases where the different microphones are attached in place of the preset microphones, a contact is turned on only when the different microphones are in-house microphones. Further, a main body unit includes a processor that, when the contact in the switch structure is turned on, automatically determines which of the X-Y technique or the A-B technique is used based on a voltage value of a certain terminal in a plug of the different microphones.

公开(公告)号：US12089014B2

公开(公告)日：2024-09-10

申请号：US17715873

申请日：2022-04-07

Applicant: Vizio, Inc.

Inventor： W. Leo Hoarty ,  Glen Gihong Kim

IPC: H04R3/00 ,  G10L25/48 ,  H02J7/00 ,  H04N7/04 ,  H04R1/04 ,  H04R1/40

CPC classification number: H04R3/005 ,  G10L25/48 ,  H04N7/04 ,  H04R1/04 ,  H04R1/406 ,  H02J7/0044 ,  H04R2420/07

Abstract: A remote control with a microphone subsystem comprising a pair of internal microphones is shown and described. When connected to a remote-control base station that is itself connected to an external power source, the microphone subsystem is continuously energized by the external power source, and the pair of internal microphones operate as far field microphones that receive oral commands uttered by a user from a distance. When the remote control is removed from the base, the microphone subsystem is configured for selective connection to an internal power source by actuating a user control on the remote control. In the external power source mode, signals from both microphones are digitally processed to provide a far-field microphone array with beam forming. In the direct current mode, only one microphone's signals are digitally processed as a simple monaural signal (or they are not digitally processed). The remote control also includes a video camera capable of capturing video image data of the user and transmitting it to an associated television for facial recognition of the user.

公开(公告)号：US20240236537A1

公开(公告)日：2024-07-11

申请号：US18610902

申请日：2024-03-20

Applicant: Knowles Electronics, LLC

Inventor： Janice LoPresti ,  Steve Kearey ,  Usha Murthy

IPC: H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.

公开(公告)号：US20240223965A1

公开(公告)日：2024-07-04

申请号：US18092285

申请日：2022-12-31

Applicant: Knowles Electronics, LLC

Inventor： Shenjie Wang ,  René Scheuner ,  Mark Niederberger

IPC: H04R19/04 ,  H03F3/45 ,  H04R1/04

CPC classification number: H04R19/04 ,  H03F3/45475 ,  H04R1/04 ,  H03F2200/165 ,  H04R2201/003

Abstract: A capacitive sensor assembly is disclosed, including a capacitive motor coupled to a charge pump circuit via a low pass filter, and a frontend amplifier circuit having an input coupled to the capacitive motor interface and an output coupled to an output of the electrical circuit. An injection current source (ICS) is coupled to the charge pump circuit output and configured to control voltage across a diode-based resistive element of the low pass filter during a transient startup phase of the charge pump circuit, wherein a settling time of the charge pump is reduced.

公开(公告)号：US12015894B2

公开(公告)日：2024-06-18

申请号：US18315481

申请日：2023-05-10

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Wenbing Zhou ,  Xin Qi ,  Fengyun Liao ,  Yongshuai Yuan

IPC: H04R1/28 ,  H04R1/04 ,  H04R1/08

CPC classification number: H04R1/2876 ,  H04R1/04 ,  H04R1/08

Abstract: The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.

公开(公告)号：US20240155279A1

公开(公告)日：2024-05-09

申请号：US18323391

申请日：2023-05-24

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Jinyu Zhang

IPC: H04R1/04

CPC classification number: H04R1/04 ,  H04R2499/13

Abstract: A microphone is provided. The microphone includes a housing having an accommodating cavity, a circuit board fixed to the accommodating cavity, an interface assembly fixed to an outer side of the housing and electrically connected to the circuit board, and a microphone unit fixed to the circuit board. The housing includes a shell having the accommodating cavity and a cover plate fixed to the housing and covering the accommodating cavity, the interface assembly is fixed to one side of the shell away from the cover plate, an insertion direction of the interface assembly is perpendicular to a surface of the circuit board. The microphone cancels the weak connecting plate, which can enhance the connection strength between interface assembly and the housing, which is conducive to miniaturizing the microphone and allowing it to flexibly adapt to different installation methods.

公开(公告)号：US11977275B2

公开(公告)日：2024-05-07

申请号：US17172034

申请日：2021-02-09

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Yueqiang Wang ,  Haofeng Zhang ,  Yongjian Li ,  Yunbin Chen ,  Fen You ,  Lei Zhang

IPC: G02C11/00 ,  G02C5/14 ,  G02C5/22 ,  G02C11/06 ,  H04R1/02 ,  H04R1/04 ,  H04R1/06 ,  H04R1/10 ,  H04R1/28 ,  H04R9/02 ,  H04R9/06 ,  H04R25/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02C11/10 ,  G02C5/14 ,  G02C5/143 ,  G02C5/22 ,  G02C5/2254 ,  G02C11/06 ,  H04R1/02 ,  H04R1/028 ,  H04R1/04 ,  H04R1/06 ,  H04R1/10 ,  H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1075 ,  H04R1/1083 ,  H04R1/28 ,  H04R9/02 ,  H04R9/025 ,  H04R9/06 ,  H04R25/65 ,  H05K1/028 ,  H05K1/189 ,  H04R2460/13 ,  H05K2201/05

Abstract: The present disclosure embodiment may disclose a glasses including a glasses frame and two speakers. The glasses frame may include a glasses rim and two glasses temples. The two glasses temples may be rotatably connected to the glasses rim, respectively. The two speakers may include an earphone core. The two speakers may be connected to the two glasses temples via hinge components of the two glasses temples, respectively. The hinge components may be rotatable to change a position of each of the speakers relative to connected one of the glasses temples. The glasses temple may include a circuit component or a battery to drive the earphone core to vibrate to generate a sound. In the present disclosure, the glasses rim and the glasses temple may be connected through a rotating shaft, thereby protecting the connection wire in the glasses and extending the life of the connection wire.