公开(公告)号：US6045866A

公开(公告)日：2000-04-04

申请号：US135672

申请日：1998-08-18

Applicant: Ho-chih Chuang

Inventor： Ho-chih Chuang

IPC: C23C18/16 ,  H05K3/18 ,  H05K9/00 ,  B05D3/04

CPC classification number: H05K9/0084 ,  C23C18/1614 ,  C23C18/2086 ,  C23C18/22 ,  H05K3/181

Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.

Abstract translation: 公开了一种在塑料基板的一个单个表面上形成无电镀金属层的方法及其产品。 该方法包括以下步骤：用于形成基材的材料的脱脂或预蚀刻，蚀刻材料，在材料的第一表面上加入催化，活化，干燥，喷涂非导电涂料，加速，形成无电镀铜层 材料的第二表面，激活，在材料的第二表面上形成化学镀镍层，进行密封，脱水，干燥，检查和包装。 其中喷涂非导电涂料和干燥的步骤使材料在其第一表面上具有美丽的外观。 材料的第一表面上的非导电涂料便于在材料的第二表面上容易地形成光滑的无电镀铜和镍镀层。 因此，该方法的产品可用于需要高灵敏度的电子产品中。

公开(公告)号：US5761479A

公开(公告)日：1998-06-02

申请号：US422081

申请日：1995-03-31

Applicant: Hung-Ta Huang ,  Te-Chih Chuang ,  Yunn-Hung Liao ,  Yi-Hsien Lee ,  Lung Wei

Inventor： Hung-Ta Huang ,  Te-Chih Chuang ,  Yunn-Hung Liao ,  Yi-Hsien Lee ,  Lung Wei

IPC: G06F9/38 ,  G06F13/40 ,  G06F15/78 ,  G06F15/76

CPC classification number: G06F9/3879 ,  G06F13/4068 ,  G06F15/7864 ,  G06F9/3877

Abstract: A single chip replacement upgradeable/downgradeable data processing system capable of operating with different types of central processing unit (CPU) chips. The system has a first socket for registration of a first CPU chip and a second socket for registration of a second CPU chip. Circuitry is provided for preventing possible signal contention between the first and second CPU chips and for synchronizing clocks for operating a CPU with the system clock. Circuitry is also provided for interfacing with a coprocessor associated with the different types of CPU chips as well as for adjusting the signals to and from the CPU chips to the signal width of the system.

Abstract translation: 单芯片替换可升级/降级的数据处理系统，能够使用不同类型的中央处理器（CPU）芯片进行操作。 该系统具有用于注册第一CPU芯片的第一插座和用于注册第二CPU芯片的第二插座。 提供电路，用于防止第一和第二CPU芯片之间的可能的信号争用，并且用于同步用于与系统时钟一起操作CPU的时钟。 还提供电路用于与与不同类型的CPU芯片相关联的协处理器的接口，以及用于将来自/或从CPU芯片的信号调整到系统的信号宽度。