公开(公告)号：US11539007B2

公开(公告)日：2022-12-27

申请号：US17166385

申请日：2021-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungin Lee ,  Kyuyoung Hwang ,  Soyeon Kim ,  Aram Jeon ,  Hyeonho Choi ,  Hyun Koo ,  Sangdong Kim ,  Yoonhyun Kwak ,  Ohyun Kwon ,  Byoungki Choi

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06 ,  H01L51/50

Abstract: An organometallic compound represented by Formula 1A: wherein, in Formula 1A, groups and variables are the same as described in the specification.

公开(公告)号：US20220306667A1

公开(公告)日：2022-09-29

申请号：US17693737

申请日：2022-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungjoon Kang ,  Sangdong Kim ,  Kum Hee Lee ,  Banglin Lee ,  Hwayoung Cho ,  Byoungki Choi ,  Kyuyoung Hwang

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound represented by Formula 1: M(L1)n1(L2)n2  Formula 1 wherein M is a transition metal, L1 is a ligand represented by Formula 2-1, L2 is a ligand represented by Formula 2-2, n1 and n2 are each independently 1 or 2, a sum of n1 and n2 is 2 or 3, and L1 and L2 are different from each other: wherein Y1, Y4, X1, X21, ring CY1, ring CY21, ring CY22, ring CY14, A1, a1, a2, b1, c1, R11 to R14, R21 to R23, and Z1 to Z5 are as defined in the specification, * and *′ in Formulae 2-1 and 2-2 each indicates a binding site to M, and * in Formula 3 indicates a binding site to ring CY1 in Formula 2-1.

公开(公告)号：US20220185834A1

公开(公告)日：2022-06-16

申请号：US17552573

申请日：2021-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Virendra Kumar RAI ,  Bumwoo Park ,  Sangdong Kim ,  Hyungjun Kim ,  Myungsun Sim ,  Byoungki Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound represented by Formula 1: M1(Ln1)n1(Ln2)n2   Formula 1 wherein Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 0, 1, or 2, n2 is 1, 2, or 3, provided that the sum of n1 and n2 is at least 3, wherein CY1, CY2, CY3, R10, R20, R30, X1, X2, Y1 to Y8, and b10 to b30 are as described herein, and wherein * and *′ each indicate a binding site to M1.

公开(公告)号：US20210355148A1

公开(公告)日：2021-11-18

申请号：US17319489

申请日：2021-05-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwon Choi ,  Yongsuk Cho ,  Seungyeon Kwak ,  Sangdong Kim ,  Soyeon Kim ,  Sukekazu ARATANI ,  Sunghun Lee ,  Jiyoun Lee ,  Dmitry KRAVCHUK

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound represented by Formula 1: wherein, in Formula 1, R37 is hydrogen, deuterium, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C2-C10 heterocycloalkyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C2-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, or a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group; and ring CY1, R21 to R26, R30a, and R30b, are as described herein.

公开(公告)号：US10461265B2

公开(公告)日：2019-10-29

申请号：US15091603

申请日：2016-04-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Aram Jeon ,  Ohyun Kwon ,  Yoonhyun Kwak ,  Kum Hee Lee ,  Kyuyoung Hwang ,  Sangdong Kim ,  Byoungki Choi ,  Hyeonho Choi

IPC: H01L51/00 ,  C09K11/06 ,  C07F15/00 ,  H01L51/50

Abstract: An organometallic compound represented by Formula 1: wherein, in Formula 1, groups and variables are the same as described in the specification.