公开(公告)号：US06584897B2

公开(公告)日：2003-07-01

申请号：US10155654

申请日：2002-05-23

申请人： Chad Cobbley ,  Ford B. Grigg

发明人： Chad Cobbley ,  Ford B. Grigg

IPC分类号： B41N124

CPC分类号： B41F15/0818 ,  B41M1/12 ,  B41N1/24 ,  B41N1/248 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/1225 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10719 ,  H01L2224/0401

摘要： A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.

公开(公告)号：US06427587B1

公开(公告)日：2002-08-06

申请号：US09894935

申请日：2001-06-28

申请人： Chad Cobbley ,  Ford B. Grigg

发明人： Chad Cobbley ,  Ford B. Grigg

IPC分类号： B41N124

CPC分类号： B41F15/0818 ,  B41M1/12 ,  B41N1/24 ,  B41N1/248 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/1225 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10719 ,  H01L2224/0401

摘要： A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.