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公开(公告)号：US08339431B2
公开(公告)日：2012-12-25
申请号：US12928261
申请日：2010-12-07
IPC分类号： B41J2/335
CPC分类号： B41J2/33585 , B41J2/3358
摘要： Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).
摘要翻译： 提供一种热敏头，其包括在支撑基板和上基板之间的中间层，其能够在保持打印质量的同时抑制向支撑基板的散热。 使用的是热头（1），包括：上基板（5）; 在所述上基板（5）的一个表面侧以层叠状态接合的支撑基板（3）。 设置在上基板（5）的另一表面侧的发热电阻（7）; 以及包括在对应于所述加热电阻器（7）的区域中形成空腔部分（4）的凹部的中间层（6），所述中间层（6）设置在所述上基板（5）和所述支撑基板 （3），其中中间层（6）由具有比上基板（5）和支撑基板（3）的熔点低的熔点的板状玻璃材料形成。
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公开(公告)号：US08334886B2
公开(公告)日：2012-12-18
申请号：US12804723
申请日：2010-07-28
IPC分类号： B41J2/335
CPC分类号： B41J2/3355 , B41J2/3359
摘要： A thermal head has a support substrate, an upper plate substrate having a back surface bonded to a top surface of the support substrate, and a heating resistor provided on the upper plate substrate. A concave portion is formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate and opposes the heating resistor. A through portion is formed in the upper plate substrate and passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction. The upper plate substrate functions as a heat accumulating layer, and the concave portion functions as a heat insulating layer.
摘要翻译： 热敏头具有支撑基板，具有与支撑基板的顶面接合的背面的上板基板和设置在上板基板上的发热电阻。 在支撑基板的上表面和上板基板的背面中的至少一个的区域中形成有凹部，与该加热电阻相对。 在上板基板上形成贯通部，从上板基板的顶面到板厚方向的支承基板的上表面贯通上板基板。 上板基板用作蓄热层，凹部用作隔热层。
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公开(公告)号：US08257599B2
公开(公告)日：2012-09-04
申请号：US12592866
申请日：2009-12-03
IPC分类号： H01L21/302 , H01L21/461 , H01L21/31 , H01L21/469 , G01D15/00 , G11B5/127 , C03C15/00 , C03C25/68
CPC分类号： B41J2/33585 , B41J2/3359
摘要： In a thermal head manufacturing method, at least one concave portion is formed on a surface of a first substrate, and a second substrate comprised of a first layer and a second layer that is denser and harder than the first layer is provided. The first and second substrates are bonded to one another so that the second layer of the second substrate covers the concave portion of the first substrate. The first layer of the second substrate is then etched until a surface of the second layer of the second substrate is exposed. At least one heating resistor is formed on the exposed surface of the second layer of the second substrate after the etching step so that the heating resistor is disposed over the concave portion of the first substrate.
摘要翻译： 在热头制造方法中，在第一基板的表面上形成至少一个凹部，并且设置由比第一层更致密且硬的第一层和第二层构成的第二基板。 第一和第二基板彼此接合，使得第二基板的第二层覆盖第一基板的凹部。 然后蚀刻第二衬底的第一层，直到第二衬底的第二层的表面露出。 在蚀刻步骤之后，在第二基板的第二层的暴露表面上形成至少一个加热电阻器，使得加热电阻器设置在第一基板的凹部上。
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公开(公告)号：US08212849B2
公开(公告)日：2012-07-03
申请号：US12797980
申请日：2010-06-10
IPC分类号： B41J2/335
CPC分类号： B41J2/3359 , Y10T29/49083
摘要： There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression: Ra≦loge(T2)/(3×106)+6.5×10−6.
摘要翻译： 提供了一种在与加热电阻器相对的位置处制造具有中空部分的热敏头的方法，该制造方法确保了对热敏头的上板基板具有足够的强度。 该制造方法包括：处理结合到支撑基板上的上板基板的上表面，将上板基板薄化成厚度T; 其特征在于，所述处理包括：对所述上板基板的上表面进行处理，使得所述上板基板的上表面的粗糙度Ra满足下式：Ra＆nlE; loge（T2）/（3×106）+6.5×10-6 。
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55.发明授权公开(公告)号：US08189019B2
公开(公告)日：2012-05-29
申请号：US12613887
申请日：2009-11-06
IPC分类号： B41J2/335
CPC分类号： B41J2/33525 , B41J2/33585
摘要： To improve printing quality and reduce manufacturing cost, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The adhesive layer (12) includes a first adhesive layer (12a) laminated on the surface of the supporting substrate (11) and a second adhesive layer (12b) laminated on a surface of the heat storage layer (13). The elastic material constituting the second adhesive layer (12b) is arranged so that the elastic material is in a bonded state with respect to at least a part of the surface of the heat storage layer (13) opposed to the cavity portion (19).
摘要翻译： 为了提高打印质量并降低制造成本，多个加热电阻器（14）通过经由粘合剂层（12）层叠在支撑基板（11）的表面上的储热层（13）上布置有空隙， 弹性材料。 在支撑基板（11）和蓄热层（13）之间的区域形成有空腔部分（19），该区域与多个加热电阻器（14）中的每一个的发热部分相对。 粘合剂层（12）包括层叠在支撑基板（11）的表面上的第一粘合层（12a）和层叠在蓄热层（13）的表面上的第二粘接层（12b）。 构成第二粘合层（12b）的弹性材料被布置成使得弹性材料相对于与空腔部分（19）相对的储热层（13）的表面的至少一部分处于接合状态。
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公开(公告)号：US08169452B2
公开(公告)日：2012-05-01
申请号：US12586990
申请日：2009-09-30
IPC分类号： B41J2/335
CPC分类号： B41J2/33535 , B41J2/3355 , B41J2/33585 , B41J25/312
摘要： A thermal head has a heat storage layer bonded onto a surface of the substrate, a heating resistor provided on the heat storage layer, and a pair of electrode portions connected to the heating resistor. The heating resistor has a heating portion which does not overlap the pair of electrode portions. A hollow portion is provided in a region of at least one of the surface of the substrate and a surface of the heat storage layer, the region being opposed to the heating resistor. A center line of the hollow portion is shifted with respect to a center line of a heating portion of the heating resistor.
摘要翻译： 热敏头具有结合到基板的表面上的储热层，设置在储热层上的加热电阻器和连接到加热电阻器的一对电极部分。 加热电阻器具有不与一对电极部分重叠的加热部分。 在基板的表面和蓄热层的表面中的至少一个的区域中设置有中空部，该区域与加热电阻体相对。 中空部分的中心线相对于加热电阻器的加热部分的中心线移动。
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公开(公告)号：US20120069124A1
公开(公告)日：2012-03-22
申请号：US13200248
申请日：2011-09-21
CPC分类号： B41J2/3357 , B41J2/33575 , B41J2/3359
摘要： In order to secure printing quality, provided is a head unit (10) including: a thermal head (9), including a heating body (15) formed on one surface of a glass substrate made of a transparent glass material, the heating body being configured to generate heat when supplied with external power; and a support body (11) which is laminated onto the glass substrate in a stacked state, in which the glass substrate and the support body (11) include a plurality of lamination reference marks (21) and a plurality of head positioning reference marks (23), respectively, which are disposed so as to be mutually aligned in a direction along the one surface of the glass substrate.
摘要翻译： 为了确保打印质量，提供了一种头单元（10），包括：热敏头（9），其包括形成在由透明玻璃材料制成的玻璃基板的一个表面上的加热体（15），所述加热体为 配置为在外部供电时产生热量; 以及层叠在所述玻璃基板上的层叠状态的支撑体（11），所述玻璃基板和所述支撑体（11）具有多个层叠基准标记（21）和多个头部定位基准标记（ 23），其被设置为沿着沿着玻璃基板的一个表面的方向相互对准。
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公开(公告)号：US20110141216A1
公开(公告)日：2011-06-16
申请号：US12928257
申请日：2010-12-07
IPC分类号： B41J2/335
CPC分类号： B41J2/3351 , B41J2/33545
摘要： Provided is a thermal head capable of making good contact to a thermal recording medium or the like to increase heat transfer efficiency while maintaining the number of manufacturing steps and manufacturing cost. Provided is a thermal head (1) including: a flat plate-shaped substrate main body (13); a heating resistor (15) of a substantially rectangular shape formed on a surface of the flat plate-shaped substrate main body (13); and a pair of electrodes (17A, 17B) connected to both ends of the heating resistor (15), for supplying power to the heating resistor (15), in which the pair of electrodes (17A, 17B) respectively include connecting portions (27A, 27B) having a width dimension smaller than a width dimension of the heating resistor (15), and the connecting portions (27A, 27B) are connected to the heating resistor (15) at positions shifted from each other in a width direction of the heating resistor (15).
摘要翻译： 提供了一种能够在保持制造步骤数量和制造成本的同时与热记录介质等良好接触以提高传热效率的热敏头。 提供一种热敏头（1），包括：平板状基板主体（13）; 形成在所述平板状基板主体（13）的表面上的大致矩形形状的发热电阻体（15）。 以及连接到所述加热电阻器（15）的两端的一对电极（17A，17B），用于向所述加热电阻器（15）供电，所述一对电极（17A，17B）分别包括连接部分（27A ，27B），其宽度尺寸小于所述加热电阻器（15）的宽度尺寸，并且所述连接部分（27A，27B）在所述加热电阻器（15）的宽度方向上彼此偏移的位置连接到所述加热电阻器 加热电阻（15）。
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公开(公告)号：US20110128340A1
公开(公告)日：2011-06-02
申请号：US12927306
申请日：2010-11-10
CPC分类号： B41J2/33535 , B41J2/33585 , B41J2/3359 , Y10T29/49083
摘要： Provided is a thermal head with enhanced strength and improved thermal efficiency including a cavity portion formed therein at a position corresponding to a heating resistor. Employed is a thermal head (1) including: a support substrate (3) including a concave portion (2) formed in its front surface; an upper substrate (5) bonded in a stacked state to the front surface of the support substrate (3); a heating resistor (7) provided on the front surface of the upper substrate (5) at a position corresponding to the concave portion (2); a pair of electrode portions (8) provided on both sides of the heating resistor (7); and a concave portion (20) formed in the front surface of the upper substrate (5) on a side of the pair of electrode portions (8), the concave portion being provided between the pair of electrode portions (8).
摘要翻译： 提供一种具有增强的强度和改善的热效率的热敏头，包括在与加热电阻相对应的位置处形成的空腔部分。 使用的是热敏头（1），包括：支撑基板（3），包括形成在其前表面上的凹部（2） 将上部基板（5）以堆叠状态接合到所述支撑基板（3）的前表面; 在与所述凹部（2）对应的位置设置在所述上基板（5）的前表面上的发热电阻体（7） 设置在所述加热电阻体（7）两侧的一对电极部（8）。 以及形成在所述一对电极部（8）的一侧的所述上基板（5）的前表面的凹部（20），所述凹部设置在所述一对电极部（8）之间。
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公开(公告)号：US20110074907A1
公开(公告)日：2011-03-31
申请号：US12586989
申请日：2009-09-30
CPC分类号： B41J2/3355 , B41J2/33585 , Y10T29/49083
摘要： To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.
摘要翻译： 为了实现对外部负载的加热效率和强度的提高，提供了一种热敏头（1），包括：支撑基板（3），其具有形成有凹部（2）的表面; 结合到所述支撑基板（3）的表面上的储热层（5）; 设置在与所述支撑基板（3）的凹部（2）相对的区域中的加热电阻器，位于所述储热层（5）上。 以及设置在由所述凹部（2）形成在所述支撑基板（3）和所述蓄热层（5）之间的中空部内的与所述蓄热层（5）接触的突出部（2A） ），并且当加热电阻器被加压预定负载或更多时限制储热层（5）的偏转。
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