公开(公告)号：US6001733A

公开(公告)日：1999-12-14

申请号：US164856

申请日：1998-10-01

Applicant: Yimin Huang ,  Ming-Sheng Yang ,  Tri-Rung Yew

Inventor： Yimin Huang ,  Ming-Sheng Yang ,  Tri-Rung Yew

IPC: H01L21/3205 ,  H01L21/321 ,  H01L21/768 ,  H01L23/52 ,  H01L21/44

CPC classification number: H01L21/76843 ,  H01L21/3212 ,  H01L21/76808 ,  H01L21/76813 ,  H01L21/7684 ,  H01L2221/1031

Abstract: A method for forming dual damascene is provided. First, a first inter-metal dielectric layer and a stop layer is formed on a substrate, and then a first photoresist pattern including a via hole and a dummy metal line is patterned and the stop layer is etched for forming via hole. Next, a second inter-metal dielectric layer is deposited and then a second photoresist pattern is patterned for forming metal line trench by etching. Afterwards, a glue layer and a metal layer are blanketed and the dual damascene structure is formed by chemical mechanical polishing.

Abstract translation: 提供了一种形成双镶嵌的方法。 首先，在基板上形成第一金属间介电层和停止层，然后对包括通孔和虚拟金属线的第一光致抗蚀剂图案进行图案化，并且对停止层进行蚀刻以形成通孔。 接下来，沉积第二金属间介电层，然后对第二光致抗蚀剂图案进行图案化以通过蚀刻形成金属线沟槽。 然后，胶合层和金属层被覆盖，并通过化学机械抛光形成双镶嵌结构。