Ultrasound device with elevational beamforming

    公开(公告)号:US11571184B2

    公开(公告)日:2023-02-07

    申请号:US16837945

    申请日:2020-04-01

    Abstract: Aspects of the technology described herein relate to apparatuses and methods for performing elevational beamforming of ultrasound data. Elevational beamforming may be implemented by different types of control circuitry. Certain control circuitry may be configured to control memory such that ultrasound data from different elevational channels is summed with stored ultrasound data in the memory that was collected at different times. Certain control circuitry may be configured to control a decimator to decimate ultrasound data from different elevational channels with different phases. Certain control circuitry may be configured to control direct digital synthesis circuitry to add a different phase offset to complex signals generated by the DDS circuitry for multiplying with ultrasound data from different elevational channels.

    ULTRASONIC IMAGING COMPRESSION METHODS AND APPARATUS

    公开(公告)号:US20230000472A1

    公开(公告)日:2023-01-05

    申请号:US17841257

    申请日:2022-06-15

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.

    Ultrasound apparatuses and methods for fabricating ultrasound devices

    公开(公告)号:US11375980B2

    公开(公告)日:2022-07-05

    申请号:US16404672

    申请日:2019-05-06

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

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