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公开(公告)号：US12053323B2
公开(公告)日：2024-08-06
申请号：US16401870
申请日：2019-05-02
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
CPC classification number: A61B8/12 , B06B1/0207 , B06B1/0292 , B06B1/0622 , G01N29/2406 , H10N30/204
Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.
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公开(公告)号：US11559827B2
公开(公告)日：2023-01-24
申请号：US17192700
申请日：2021-03-04
Applicant: BFLY Operations, Inc.
Inventor： Susan A. Alie , Keith G. Fife , Joseph Lutsky , David Grosjean
Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
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公开(公告)号：US11388524B2
公开(公告)日：2022-07-12
申请号：US17114411
申请日：2020-12-07
Applicant: BFLY Operations, Inc.
Inventor： Joseph Lutsky , Nevada J. Sanchez , Kailiang Chen , Keith G. Fife , Tyler S. Ralston
Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
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公开(公告)号：US11815492B2
公开(公告)日：2023-11-14
申请号：US17232100
申请日：2021-04-15
Applicant: BFLY Operations, Inc.
Inventor： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
IPC: G01N29/24 , A61B8/00 , H03F1/32 , H03K5/24 , H03M3/00 , G01N29/30 , G01S7/52 , B06B1/02 , G01S15/89 , H03F3/45
CPC classification number: G01N29/2406 , A61B8/58 , G01N29/30 , G01S7/5205 , H03F1/3211 , H03F3/45475 , H03K5/24 , H03M3/458 , B06B1/0292 , G01N2291/02475 , G01S15/8915 , H03F2200/129 , H03F2203/45116
Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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公开(公告)号：US12203894B2
公开(公告)日：2025-01-21
申请号：US18507509
申请日：2023-11-13
Applicant: BFLY OPERATIONS, INC.
Inventor： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
IPC: G01N29/24 , A61B8/00 , B06B1/02 , G01N29/30 , G01S7/52 , G01S15/89 , H03F1/32 , H03F3/45 , H03K5/24 , H03M3/00
Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240159714A1
公开(公告)日：2024-05-16
申请号：US18507509
申请日：2023-11-13
Applicant: BFLY OPERATIONS, INC.
Inventor： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
CPC classification number: G01N29/2406 , A61B8/58 , G01N29/30 , G01S7/5205 , H03F1/3211 , H03F3/45475 , H03K5/24 , H03M3/458 , B06B1/0292
Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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公开(公告)号：US20250090138A1
公开(公告)日：2025-03-20
申请号：US18793062
申请日：2024-08-02
Applicant: BFLY Operations, Inc
Inventor： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.
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8.发明授权公开(公告)号：US11655141B2
公开(公告)日：2023-05-23
申请号：US16585283
申请日：2019-09-27
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Keith G. Fife , Joseph Lutsky , Lingyun Miao
CPC classification number: B81B7/0038 , A61B8/4483 , B81C1/00158 , G10K13/00 , H04R31/003 , B81B2201/0271 , G10K11/28
Abstract: A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.
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公开(公告)号：US20220313219A1
公开(公告)日：2022-10-06
申请号：US17845940
申请日：2022-06-21
Applicant: BFLY Operations, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号：US11986349B2
公开(公告)日：2024-05-21
申请号：US16401630
申请日：2019-05-02
Applicant: BFLY OPERATIONS, INC.
Inventor： Keith G. Fife , Jianwei Liu , Joseph Lutsky , Sarp Satir , Jungwook Yang
CPC classification number: A61B8/4483 , A61B8/06 , B06B1/00 , B06B1/0292 , A61B8/4444 , A61B8/483 , A61B8/5207 , B06B2201/76
Abstract: An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
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