公开(公告)号：US20200211477A1

公开(公告)日：2020-07-02

申请号：US16814119

申请日：2020-03-10

Applicant: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Weilin LAI ,  Yucheng CHAN ,  Jianbang HUANG ,  Dachao LI ,  Shengji YANG ,  Pengcheng LU ,  Kuanta HUANG ,  Xiaochuan CHEN ,  Xue DONG ,  Hui WANG ,  Yanming WANG ,  Chen XU ,  Dacheng ZHANG ,  Yongfa DONG ,  Qing WANG ,  Hui TONG ,  Yunlong LI

IPC: G09G3/3291 ,  G09G3/3266 ,  G09G3/3258 ,  H01L27/32

Abstract: A display substrate and a driving method thereof are provided. The display substrate includes a base substrate containing a monocrystalline silicon layer, a thickness of the monocrystalline silicon layer being less than that of the base substrate; an array circuit layer, disposed on the base substrate and including a plurality of transistors, each of which has an active layer inside the monocrystalline silicon layer; and a plurality of light-emitting elements, located at a side of the array circuit layer away from the base substrate. The array circuit layer includes a scan driving circuit, a data driving circuit and a plurality of pixel sub-circuits, and the plurality of pixel sub-circuits are connected to the plurality of light-emitting elements, respectively, to form a plurality of sub-pixels.

公开(公告)号：US20180086041A1

公开(公告)日：2018-03-29

申请号：US15540813

申请日：2016-05-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liqiang CHEN ,  Chen XU ,  Benlian WANG

IPC: B32B37/10 ,  B32B3/26 ,  B32B38/00

CPC classification number: B32B37/10 ,  B32B3/266 ,  B32B38/0004 ,  B32B2310/0843 ,  B32B2457/20 ,  H05K5/0017

Abstract: A method for bonding a backsheet is disclosed. The bonding is performed in two steps to ensure the bonded flexible master plate has a uniform size. The first pressure in the first bonding is smaller than the second pressure in the second bonding. A relatively small pressure is used in the first bonding to attach the backsheet to the back surface of the flexible master plate, so that the backsheet is subject to small deformation and the uniformity in size is ensured. The pressure is increased in the second bonding to exert sufficient force on the backsheet, increase firmness of attachment, and ensure that the bonded flexible master plate has a uniform size.