Undoped polysilicon gate process for NMOS ESD protection circuits
    61.
    发明授权
    Undoped polysilicon gate process for NMOS ESD protection circuits 失效
    用于NMOS ESD保护电路的未掺杂多晶硅栅极工艺

    公开(公告)号:US5783850A

    公开(公告)日:1998-07-21

    申请号:US663436

    申请日:1996-06-13

    IPC分类号: H01L27/02 H01L23/62

    CPC分类号: H01L27/0266

    摘要: An improved process and integrated-circuit having CMOS (NMOS and/or PMOS) devices formed on a substrate and a NMOS electro static discharge circuit formed in a P well on the substrate. The improvement includes an electro static discharge NMOS circuit having an undoped polysilicon gate electrode, and the NMOS FET devices having n-type doped gate electrodes. The undoped gate polysilicon electrode of the electro static discharge transistor increases the gate oxide breakdown voltage thus making the ESD transistor able to withstand a greater voltage discharge and therefore providing better protection to the product devices.

    摘要翻译: 在衬底上形成有CMOS(NMOS和/或PMOS)器件的改进的工艺和集成电路以及形成在衬底上的P阱中的NMOS静电放电电路。 该改进包括具有未掺杂多晶硅栅电极的静电放电NMOS电路,以及具有n型掺杂栅电极的NMOS FET器件。 静电放电晶体管的未掺杂栅极多晶硅电极增加了栅极氧化物击穿电压,从而使ESD晶体管能够承受更大的电压放电,从而为产品器件提供更好的保护。