公开(公告)号：US20100123383A1

公开(公告)日：2010-05-20

申请号：US12365865

申请日：2009-02-04

申请人： Jung-Yu Li ,  Shih-Pu Chen ,  Yi-Ping Lin ,  Yen-I Chou ,  Po-Hung Wang ,  Ming-Chung Liu

发明人： Jung-Yu Li ,  Shih-Pu Chen ,  Yi-Ping Lin ,  Yen-I Chou ,  Po-Hung Wang ,  Ming-Chung Liu

IPC分类号： H01J63/04

CPC分类号： H01J63/06

摘要： A dual-purpose light-penetrating and light-emitting device is provided. The dual-purpose light-penetrating and light-emitting device includes a first transparent substrate, a spacing sidewall, a second transparent substrate, and a light-penetrative illuminating structure. The spacing sidewall is disposed between the first transparent substrate and the second transparent substrate for configuring a hermetic space. The light-penetrative illuminating structure includes a cathode structure, an anode structure, a low pressure gas layer, and a patterned fluorescent layer. The low pressure gas layer is accommodated in the hermetic space. The cathode structure and the anode structure are oppositely disposed on the first transparent substrate and the second transparent substrate, respectively. The patterned fluorescent layer is positioned between the cathode structure and the anode structure, for allowing an ambient natural light penetrating therethrough.

摘要翻译： 提供了一种双用途的透光和发光装置。 双用途透光发光装置包括第一透明基板，间隔侧壁，第二透明基板和透光照明结构。 间隔侧壁设置在第一透明基板和第二透明基板之间，用于构成密封空间。 透光照明结构包括阴极结构，阳极结构，低压气体层和图案化荧光层。 低压气体层容纳在密封空间中。 阴极结构和阳极结构分别相对设置在第一透明基板和第二透明基板上。 图案化荧光层位于阴极结构和阳极结构之间，用于允许环境自然光穿透其中。

公开(公告)号：US20100078311A1

公开(公告)日：2010-04-01

申请号：US12239762

申请日：2008-09-27

申请人： Cheng-Chung LEE ,  Bo-Huei Liao ,  Ming-Chung Liu

发明人： Cheng-Chung LEE ,  Bo-Huei Liao ,  Ming-Chung Liu

IPC分类号： C23C14/46

CPC分类号： C23C14/0057 ,  C23C14/0694

摘要： An aluminum fluoride thin film deposition method includes the steps of (a) putting a substrate and a pure aluminum target in a plasma sputtering system, (b) applying argon plasma to the plasma sputtering system to remove impurities from the aluminum target, (c) applying CF4 gas, which is stable at room temperature under the atmospheric pressure, to the plasma sputtering system to bombard the aluminum target with energetic ions and to have aluminum atoms be ejected from the aluminum target and fluorinated so that a thin-film coating of aluminum fluoride is deposited on the surface of the substrate.

摘要翻译： 氟化铝薄膜沉积方法包括以下步骤：（a）将基底和纯铝靶放入等离子体溅射系统中，（b）向等离子体溅射系统中施加氩等离子体以从铝靶去除杂质，（c） 将等离子体溅射系统在常压下稳定的CF 4气体用能量离子轰击铝靶，并从铝靶上喷出铝原子并进行氟化，使铝薄膜涂层 氟化物沉积在衬底的表面上。

公开(公告)号：USD605646S1

公开(公告)日：2009-12-08

申请号：US29333568

申请日：2009-03-12

申请人： Chia-Lin Chan ,  Ming-Chung Liu ,  Chang-Kai Liu ,  Li-Fang Chen ,  Hong-Tien Wang ,  You-Chi Liu

设计人： Chia-Lin Chan ,  Ming-Chung Liu ,  Chang-Kai Liu ,  Li-Fang Chen ,  Hong-Tien Wang ,  You-Chi Liu