公开(公告)号：US20070138585A1

公开(公告)日：2007-06-21

申请号：US11305654

申请日：2005-12-16

申请人： Chung Hsin ,  Chen Peng ,  Mon Ho

发明人： Chung Hsin ,  Chen Peng ,  Mon Ho

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor package includes a substrate having an upper surface, which is formed with a chip region and first electrodes located on the periphery of the chip region, and a lower surface. A chip is mounted on the chip region of the upper surface of the substrate. A frame layer is arranged on the upper surface of the substrate to surround the chip. Four posts are arranged on the upper surface of the substrate and are located on the angle the frame layer. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. A transparent layer is mounted on the four posts to cover the chip.

摘要翻译： 图像传感器封装包括具有上表面的基板，其形成有芯片区域和位于芯片区域周边的第一电极以及下表面。 芯片安装在基板的上表面的芯片区域上。 框架层布置在基板的上表面上以围绕芯片。 在基板的上表面上布置有四个柱，并且位于框架层的角度上。 多个导线将芯片的接合焊盘电连接到衬底的第一电极。 透明层安装在四个柱上以覆盖芯片。

公开(公告)号：USD541748S1

公开(公告)日：2007-05-01

申请号：US29224624

申请日：2005-03-07

申请人： Yung Chi Peng ,  Chung Hsin Huang

设计人： Yung Chi Peng ,  Chung Hsin Huang

公开(公告)号：US07198522B1

公开(公告)日：2007-04-03

申请号：US11585158

申请日：2006-10-24

申请人： Hsin-tsung Ho ,  Yu-hung Su ,  Chung-hsin Huang ,  Mei-chuan Yang

发明人： Hsin-tsung Ho ,  Yu-hung Su ,  Chung-hsin Huang ,  Mei-chuan Yang

IPC分类号： H01R24/00

CPC分类号： H01R13/6275 ,  H01R9/032 ,  H01R13/506 ,  H01R13/6583

摘要： A plug connector includes plastic covers, a mating portion and a latch. The plastic covers include an upper plastic cover and a lower plastic cover, the two plastic covers buckling with each other and forming a space. The mating portion which is fixed in the space includes a shell. A hook aperture is located on the front of the shell. The latch, which is fixed into the space, has two barricades. Each barricade stretches forward and forms an arm. Each arm has a hook at its head. The hooks pass through the hook apertures and project outwardly, wherein each barricade of the latch protrudes upward and forms a locating bulge. Correspondingly two locating cavities are defined inside the top surface of the upper plastic cover. The locating bulges are inset into the locating cavities.

摘要翻译： 插头连接器包括塑料盖，配合部分和闩锁。 塑料盖包括上塑料盖和下塑料盖，两个塑料盖彼此弯曲并形成一个空间。 固定在该空间中的配合部分包括壳体。 钩孔位于外壳的前部。 固定在空间中的闩锁有两个路障。 每个路障向前延伸并形成一个胳膊。 每只手臂的头部都有钩子。 钩通过钩孔并向外突出，其中闩锁的每个路障向上突出并形成定位凸起。 相应地，两个定位腔被限定在上塑料盖的顶表面内。 定位凸块插入到定位孔中。

公开(公告)号：US20070045512A1

公开(公告)日：2007-03-01

申请号：US11213256

申请日：2005-08-26

申请人： Chung Hsin ,  Sing Wu

发明人： Chung Hsin ,  Sing Wu

IPC分类号： H01L27/00

CPC分类号： H01L27/14683

摘要： A method for A method for re-forming an image sensor comprising the steps of: Providing an image sensor package element formed with an upper end having a substrate and a bottom end having a glass. Providing a film tape adhered to the glass of the image sensor. Providing a vacuum tube absorbed the substrate of the image sensor, then, stripped the glass from the image sensor.

摘要翻译： 一种用于重新形成图像传感器的方法，包括以下步骤：提供形成有具有基底的上端和具有玻璃的底端的图像传感器封装元件。 提供粘附到图像传感器的玻璃上的胶带。 提供真空管吸收图像传感器的基板，然后从图像传感器剥离玻璃。

公开(公告)号：US07140891B1

公开(公告)日：2006-11-28

申请号：US11445246

申请日：2006-06-02

申请人： Chung-Hsin Huang ,  Mei-Chuan Yang

发明人： Chung-Hsin Huang ,  Mei-Chuan Yang

IPC分类号： H01R13/44 ,  H01R13/648

CPC分类号： H01R13/5213 ,  H01R12/716 ,  H01R13/4538

摘要： A dustproof receptacle connector includes a dielectric housing having a cavity. A plurality of terminals and a dustproof means are received in the cavity. The back end of the dielectric housing is a closed end. A pair of guide grooves are defined in lateral sides of the cavity. The dustproof means includes a dustproof cover and a plurality of springs. The dustproof cover has a plate. A pair of arms extend from two opposite sides of the plate respectively. A pair of positioning pillars are defined in the inner side of the plate. The springs twine on the positioning pillars and the arms slide in the guide grooves. A block protrudes inwardly from the inner side of each arm respectively to increase the anti-stress intensity of the arms.

摘要翻译： 防尘插座连接器包括具有空腔的绝缘壳体。 多个端子和防尘装置被容纳在空腔中。 绝缘壳体的后端是封闭端。 在空腔的侧面限定一对导向槽。 防尘装置包括防尘盖和多个弹簧。 防尘盖有一块板。 一对臂分别从板的两个相对侧延伸。 一对定位柱定义在板的内侧。 弹簧在定位支柱上缠绕，手臂在导槽中滑动。 一个块分别从每个臂的内侧向内突出以增加臂的抗应力强度。

公开(公告)号：US20060217114A1

公开(公告)日：2006-09-28

申请号：US11088823

申请日：2005-03-25

申请人： Chung-Hsin Chen

发明人： Chung-Hsin Chen

IPC分类号： H04Q7/20

CPC分类号： H04W24/00 ,  H04W88/02

摘要： A customer service module used to handle a service for maintenance and repair of a wireless communication device requested by a customer is disclosed. The customer service module comprises a database storing at least a set of status information comprising a set of failure status information and a set of maintenance and repair status information and corresponding to an identification serial number of the wireless communication device. A failure information inputting interface at a service terminal is used to input the set of failure status information and a maintenance and repair status inputting interface at a maintenance and repair terminal is used to input the set of maintenance and repair status information. A status displaying interface is located at the service terminal and the maintenance and repair terminal respectively and used to display the set of failure status information or the set of maintenance and repair information according to the identification serial number.

摘要翻译： 公开了一种客户服务模块，用于处理客户要求的无线通信设备的维护和维修服务。 客户服务模块包括存储至少一组状态信息的数据库，该组状态信息包括一组故障状态信息和一组维​​护和修复状态信息，并且对应于无线通信设备的识别序列号。 使用服务终端的故障信息输入接口来输入故障状态信息组，维护维修终端的维护和维修状态输入接口用于输入维护和维修状态信息。 状态显示界面分别位于服务终端和维护维护终端，用于根据识别序列号显示故障状态信息或维护和修复信息。

公开(公告)号：US07077664B1

公开(公告)日：2006-07-18

申请号：US11073668

申请日：2005-03-08

申请人： Chin Chou Wang ,  Yi Chiu Kao ,  Chung Hsin Huang

发明人： Chin Chou Wang ,  Yi Chiu Kao ,  Chung Hsin Huang

IPC分类号： H01R9/09

CPC分类号： H04N5/2257 ,  H01R12/57 ,  H01R12/714 ,  H01R13/6582

摘要： A module connector includes an insulated component, a plurality of contacts inside the module connector and a housing shell outside of the module connector. The insulated component has four sidewalls that define an inserting space to receive another module. Each sidewall has a plurality of contacts parallel L-shaped slots to accommodate the contacts that are electrically connected with the outside module. The housing shell has four side containing walls. A pressing pin and an elastic pin are extended from the top of each side-containing wall towards the inserting space. The pressing pins prop downwardly the outside module.

摘要翻译： 模块连接器包括绝缘部件，模块连接器内部的多个触点和模块连接器外部的壳体壳体。 绝缘部件具有限定用于接收另一模块的插入空间的四个侧壁。 每个侧壁具有多个平行的L形槽，以容纳与外部模块电连接的触点。 外壳有四个侧壁。 按压销和弹性销从每个侧面容纳壁的顶部朝向插入空间延伸。 按压销将外部模块向下支撑。

公开(公告)号：USD522460S1

公开(公告)日：2006-06-06

申请号：US29224606

申请日：2005-03-07

申请人： Shu Man Chiang ,  Chung Hsin Huang ,  Yi Chiu Kao ,  Yu Hung Su

设计人： Shu Man Chiang ,  Chung Hsin Huang ,  Yi Chiu Kao ,  Yu Hung Su

公开(公告)号：US20060011811A1

公开(公告)日：2006-01-19

申请号：US10923908

申请日：2004-08-21

申请人： Chung Hsin ,  Tony Wang ,  Figo Hsieh ,  Chin Chou

发明人： Chung Hsin ,  Tony Wang ,  Figo Hsieh ,  Chin Chou

IPC分类号： H01L27/00

CPC分类号： H01L27/14625 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

摘要： An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The photosensitive chip is mounted on the upper surface of the substrate, and is electrically connected to the first electrodes of the substrate. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder. The upper end of the opening is formed with an internal thread, and the lower end of the opening is formed with a breach. The lens holder is adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.

摘要翻译： 图像传感器模块结构包括基板，感光芯片，透镜保持架和镜筒。 基板具有形成有第一电极的上表面和形成有第二电极的下表面。 感光芯片安装在基板的上表面上，并与基板的第一电极电连接。 透镜保持具有上端面，下表面和穿透透镜保持器的开口。 开口的上端形成有内螺纹，开口的下端形成有破裂。 透镜架通过胶粘在基板的上表面上，因此感光芯片位于透镜架的开口内。 透镜镜筒具有上端面，下端面和螺纹连接到透镜保持架的内螺纹的外螺纹。

公开(公告)号：US20060008939A1

公开(公告)日：2006-01-12

申请号：US10887577

申请日：2004-07-08

申请人： Abnet Chen ,  Tony Wang ,  Chung Hsin ,  Figo Hsieh

发明人： Abnet Chen ,  Tony Wang ,  Chung Hsin ,  Figo Hsieh

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensor package includes a substrate, a frame layer, a photosensitive chip, wires, and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrode of the substrate. The transparent layer is covered over the frame layer to cover the photosensitive chip.

摘要翻译： 图像传感器封装包括基板，框架层，感光芯片，布线和透明层。 基板具有形成第一电极的上表面和形成第二电极的下表面，其中每个第一电极是弯曲的。 框架层布置在基板的上表面上以与基板一起形成空腔。 感光芯片布置在空腔内并安装在基板的上表面上。 多个导线将感光芯片电连接到基板的第一电极。 透明层被覆盖在框架层上以覆盖感光芯片。