公开(公告)号：US20080303225A1

公开(公告)日：2008-12-11

申请号：US12115266

申请日：2008-05-05

申请人： John P. Franz ,  Joseph R. Allen ,  Wade D. Vinson ,  Eric Mei

发明人： John P. Franz ,  Joseph R. Allen ,  Wade D. Vinson ,  Eric Mei

IPC分类号： F16J15/02

CPC分类号： F16L5/10 ,  F04D29/083 ,  F04D29/545

摘要： A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall.

摘要翻译： 用于密封风扇的风扇外壳和外壳壁之间的风扇对接套环，通过防止流动循环来改善风扇性能。 对接套环包括限定用于空气流动的开口的柔性体。 主体具有用于与风扇壳体配合的密封件和用于密封外壳壁的边缘。

公开(公告)号：US07035096B2

公开(公告)日：2006-04-25

申请号：US10698605

申请日：2003-10-31

申请人： John P. Franz ,  Wade D. Vinson ,  Nicholas Holian

发明人： John P. Franz ,  Wade D. Vinson ,  Nicholas Holian

IPC分类号： G06F1/16

CPC分类号： G11B33/126 ,  G06F1/184 ,  G06F1/187 ,  G11B33/128 ,  H05K7/1411 ,  Y10T70/5009

摘要： According to certain embodiments, the present technique provides a locking mechanism for coupling and uncoupling a removable component coupleable to and uncoupleable from a computing device. The exemplary locking mechanism includes a first member selectively positionable between secured and unsecured configurations of the removable component with respect to the computer device. The exemplary locking mechanism also includes a second member positionable between first and second configurations, wherein the first configuration extends the second member through the first member in the second configuration to secure the first member.

摘要翻译： 根据某些实施例，本技术提供了一种锁定机构，用于联接和解耦可耦合到计算设备并且与其不可分离的可拆卸部件。 示例性的锁定机构包括可相对于计算机设备选择性地定位在可拆卸部件的固定和不安全构造之间的第一构件。 示例性的锁定机构还包括可定位在第一和第二构造之间的第二构件，其中第一构型在第二构型中通过第一构件延伸第二构件以固定第一构件。

公开(公告)号：US06724628B2

公开(公告)日：2004-04-20

申请号：US10036165

申请日：2001-12-26

申请人： John P. Franz ,  Wade David Vinson

发明人： John P. Franz ,  Wade David Vinson

IPC分类号： H05K720

CPC分类号： H01L23/544 ,  H01L23/40 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.

摘要翻译： 散热器和处理器组件，可以轻松地从电路板安装和卸载而无需工具。 散热器组件的一个优选实施例包括散热器部件，连接到散热器的基座的对准保持架，并具有用于可释放地附接处理器的连接点。 散热器组件还包括多个对准销和对准突片，其固定到散热器的底部并且与专门设计的插座和电路板接合以便对准配合部件。 处理器芯片安装在散热器上，然后将组合的组件安装到安装有电路板的插座上。 对准机构提供了一种在不使用工具的情况下安装处理器的方法，或者必须将处理器引脚手动对准插座插座。