公开(公告)号：US06987672B2

公开(公告)日：2006-01-17

申请号：US11000647

申请日：2004-12-01

申请人： John P. Franz ,  Wade David Vinson

发明人： John P. Franz ,  Wade David Vinson

IPC分类号： H05K7/20

CPC分类号： H01L23/544 ,  H01L23/40 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink has a footprint extending beyond the perimeter of the socket and is in thermal contact with the electronic device when it is engaged with the socket. The socket and the heat sink include cooperative alignment tabs and alignment slots located outside the array of mounting holes. A locking lever is pivotally connected to an arm extending from the socket to a position outside of the footprint of the heat sink.

摘要翻译： 一种可接合组件，包括插座和散热器。 插座包括具有安装孔的阵列的表面，其接收电子设备的连接器引脚，以将电子设备安装在插座的周边内。 散热器具有超出插座周边的覆盖区域，并且当其与插座接合时与电子设备热接触。 插座和散热器包括位于安装孔阵列外侧的协作对准翼片和对准槽。 锁定杆枢转地连接到从插座延伸到散热器的覆盖区域外部的位置的臂。

公开(公告)号：US06724628B2

公开(公告)日：2004-04-20

申请号：US10036165

申请日：2001-12-26

申请人： John P. Franz ,  Wade David Vinson

发明人： John P. Franz ,  Wade David Vinson

IPC分类号： H05K720

CPC分类号： H01L23/544 ,  H01L23/40 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.

摘要翻译： 散热器和处理器组件，可以轻松地从电路板安装和卸载而无需工具。 散热器组件的一个优选实施例包括散热器部件，连接到散热器的基座的对准保持架，并具有用于可释放地附接处理器的连接点。 散热器组件还包括多个对准销和对准突片，其固定到散热器的底部并且与专门设计的插座和电路板接合以便对准配合部件。 处理器芯片安装在散热器上，然后将组合的组件安装到安装有电路板的插座上。 对准机构提供了一种在不使用工具的情况下安装处理器的方法，或者必须将处理器引脚手动对准插座插座。

公开(公告)号：US06829146B2

公开(公告)日：2004-12-07

申请号：US10805901

申请日：2004-03-22

申请人： John P. Franz ,  Wade David Vinson

发明人： John P. Franz ,  Wade David Vinson

IPC分类号： H05K720

CPC分类号： H01L23/544 ,  H01L23/40 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.

摘要翻译： 一种组件，包括电路板，插座和电子设备。 插座连接到电路板，并且包括具有多个插座的表面，多个插座从电子设备设置有多个连接器针脚。 散热器与电子设备热接触，并且具有延伸超过电子设备和插座的覆盖区域。 锁定杆枢转地连接到从插座延伸到散热器的占地面积外的位置的臂。