公开(公告)号：US5764071A

公开(公告)日：1998-06-09

申请号：US583321

申请日：1996-01-05

申请人： Benson Chan ,  Hong H. Chan ,  Pratap Singh

发明人： Benson Chan ,  Hong H. Chan ,  Pratap Singh

IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R31/02

CPC分类号： G01R1/0408 ,  H05K3/325

摘要： A method in system for the testing of the electrical characteristics of an electronic module mounted on a printed circuit board. The method and system monitors selected signals from the Bottom Signal Pads of the electronic module. Thus, eliminating the need for a prototype or specialized printed circuit board in order to perform desired testing of signals.

摘要翻译： 一种用于测试安装在印刷电路板上的电子模块的电气特性的系统中的方法。 该方法和系统监视来自电子模块的底部信号垫的选定信号。 因此，为了执行期望的信号测试，不需要原型或专用印刷电路板。

公开(公告)号：US5730620A

公开(公告)日：1998-03-24

申请号：US525861

申请日：1995-09-08

申请人： Benson Chan ,  Fletcher L. Chapin ,  Theodore W. Blizinski

发明人： Benson Chan ,  Fletcher L. Chapin ,  Theodore W. Blizinski

IPC分类号： H01R33/74 ,  H05K1/18 ,  H05K3/32 ,  H05K7/20 ,  H05K1/00

CPC分类号： H01R12/52 ,  H05K3/325

摘要： Electrical components such as IC modules and printed circuit boards, at least one of which has an array of solder balls or other protruding conductors, are connected quickly, precisely and economically with a component locator having openings adapted to capture the protruding conductors. The locator is aligned with one of the components, and the other component is pressed against the locator. The protruding conductors enter the capture openings and complete electrical circuits with contacts on the other conductor.

摘要翻译： 诸如IC模块和印刷电路板的电气部件中的至少一个具有焊球或其它突出导体的阵列，其具有适于捕获突出导体的开口的部件定位器被快速，精确和经济地连接。 定位器与其中一个组件对齐，另一个组件按压定位器。 突出的导体进入捕获开口，并在另一个导体上接触完成电路。