公开(公告)号：US20150216053A1

公开(公告)日：2015-07-30

申请号：US14165982

申请日：2014-01-28

Applicant: Apple Inc.

Inventor： Matthias Sauer

IPC: H05K1/18 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package substrate may mate with contacts on the integrated circuit die. Solder may be used to connect the integrated circuit die to the first set of contacts. A covering material such as a plastic mold cap may be used to cover the integrated circuit die and the first set of contacts. The mold cap may have a rectangular shape or other footprint. A rectangular ring-shaped border region or a border region of other shapes may surround the mold cap and may be free of mold cap material. A second set of contacts on the package substrate may be formed on the surface in the border region.

Abstract translation: 集成电路封装可以具有封装衬底，其具有集成电路管芯被焊接到的表面。 封装衬底上的第一组触点可与集成电路芯片上的触点配合。 焊料可用于将集成电路管芯连接到第一组触点。 可以使用诸如塑料模具盖的覆盖材料来覆盖集成电路管芯和第一组触点。 模具帽可以具有矩形形状或其他足迹。 矩形环形边框区域或其他形状的边界区域可以围绕模具盖并且可以没有模具盖材料。 封装基板上的第二组触点可以形成在边界区域的表面上。