Abstract:
For electrically determining the level of misalignment of floating gate structures closest to a gate stack bending point in an array of flash memory cells, a plurality of test flash memory cells are formed with each test flash memory cell having a respective floating gate structure designed to be disposed a respective displacement distance from a respective gate stack bending point. An erase operation is performed for each of the test flash memory cells by biasing the test flash memory cells with voltages from a plurality of voltage sources. Each of the test flash memory cells are then biased with test voltages from the plurality of voltage sources. A respective current meter then measures a respective amount of current flowing through each of the test flash memory cells when biased with the test voltages. The level of misalignment is determined depending on which of the test flash memory cells conducts a current level that is greater than a threshold current level when biased with the test voltages. The level of misalignment is approximately equal to a highest one of the respective displacement distance corresponding to one of the test flash memory cells that conducts a current level that is greater than the threshold current level.