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公开(公告)号：US11347284B2
公开(公告)日：2022-05-31
申请号：US17012039
申请日：2020-09-03
发明人： Fengqi Zhang
IPC分类号： G06F1/20 , H05K7/20 , F21Y115/10 , F28D21/00
摘要： The present application provides a novel water cooling radiator with a detachable water pump and a built-in fan, which enables outside air to enter a cooling housing from air inlet holes in an upper end of the cooling housing and be discharged from air outlet holes in a lower end of the cooling housing, so that the air discharged from the air outlet holes can dissipate heat from and cool down various electronic components such as MOS tubes and memory chips around the motherboard and CPU, thereby improving the heat dissipation efficiency and prolonging the service life of the motherboard. A pump is connected externally to the radiator, which makes the installation and connection more convenient and the performance better.
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2.发明授权公开(公告)号：US11638366B2
公开(公告)日：2023-04-25
申请号：US17482440
申请日：2021-09-23
发明人： Fengqi Zhang
摘要： The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.
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3.发明申请公开(公告)号：US20220015263A1
公开(公告)日：2022-01-13
申请号：US17482440
申请日：2021-09-23
发明人： FENGQI ZHANG
摘要： The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.
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公开(公告)号：US20230240043A1
公开(公告)日：2023-07-27
申请号：US18190363
申请日：2023-03-27
发明人： Fengqi ZHANG
IPC分类号： H05K7/20
CPC分类号： H05K7/20272
摘要： The present invention discloses a water-cooled radiator with built-in pump spraying waterway structure. A slot formed in the body bottom shell is separated into a water storage tank and a heat sink; a water inlet is formed in the heat sink, a water outlet is formed in the water storage tank, a through hole is formed in the water-stop plate, the radiating fin fixedly covers an opening of the heat sink; one end of the water inlet pipe is communicated with a water outlet end of the water-cooled box while the other end thereof is communicated with the water inlet, one end of the water outlet pipe is communicated with the water outlet while the other end thereof is communicated with a water inlet end of the water-cooled box, and the water pumping mechanism is arranged in the water storage tank. The present invention improves the water cooling efficiency.
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公开(公告)号：US11150034B2
公开(公告)日：2021-10-19
申请号：US16663349
申请日：2019-10-25
发明人： Fengqi Zhang
摘要： A water-cooling radiator is disclosed, comprising a heat adsorption unit and a heat radiation unit, wherein the heat adsorption unit comprises an outer shell, a bottom shell, a water path cover plate and a heat adsorption soleplate which are successively connected from top to bottom; a liquid inlet pipe and a liquid outlet pipe both communicated with the heat radiation unit are arranged on the bottom shell, and a pump is arranged between the heat radiation unit and the liquid inlet pipe; a third water cavity is defined by the heat adsorption soleplate and the water path cover plate, a heat sink set arranged in the third water cavity and a first water passage hole extending in a direction perpendicular to the lengthwise direction of the heat sink set. The novel water-cooling radiator of the disclosed can improve the heat radiation effect, and facilitate for mounting, connecting, and maintaining.
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