公开(公告)号：US6042667A

公开(公告)日：2000-03-28

申请号：US810089

申请日：1997-03-03

申请人： Satoru Adachi ,  Junzo Fukuta ,  Katsuya Kawakami ,  Seigo Ooiwa

发明人： Satoru Adachi ,  Junzo Fukuta ,  Katsuya Kawakami ,  Seigo Ooiwa

IPC分类号： B32B18/00 ,  H05K1/03 ,  H05K3/46 ,  B32B31/20

CPC分类号： B32B18/00 ,  C04B2237/34 ,  C04B2237/562 ,  C04B2237/66 ,  C04B2237/68 ,  C04B35/645 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49163

摘要： A method of fabricating a ceramic multilayer substrate includes steps of laminating a plurality of green sheets including an inside green sheet formed with a conductor pattern and pressing a laminate of green sheets under a predetermined pressure together with sheet restricting members applied to opposite surfaces of the laminate respectively, thereby bonding the laminate and sheet restricting members together, each sheet restricting member having a smaller percent change in thickness than the green sheets during the bonding and a higher firing temperature than the green sheets, firing a bonded assemblage of the green sheets and sheet restricting members at a firing temperature of the green sheets, and removing the sheet restricting members from the opposite surfaces of a fired body.

摘要翻译： 一种制造陶瓷多层基板的方法包括以下步骤：将包含由导体图案形成的内部生片的多个生片与将预定压力的生片层叠在一起，与施加到层压体的相对表面的片限制构件 从而将层叠体和片材限制构件粘合在一起，每个片材限制构件在接合期间具有比生片的更小的变化百分比，并且比生坯片具有更高的烧制温度，焙烧生片和片材的接合组合 在生坯的烧成温度下限制构件，并且从烧制体的相对表面除去片材限制构件。