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公开(公告)号:US20190252108A1
公开(公告)日:2019-08-15
申请号:US16107322
申请日:2018-08-21
申请人: SUMIDA CORPORATION
发明人: Tomoyuki KANNO , Hiroyuki MOMOI
CPC分类号: H01F27/2804 , H01F17/0013 , H01F27/24 , H01F41/041 , H01F2017/002 , H01F2027/2809 , H01F2027/2819 , H05K1/113 , H05K1/114 , H05K1/144 , H05K1/165 , H05K3/4611 , H05K3/4638 , H05K2201/041 , H05K2201/09063 , H05K2201/096 , H05K2201/09672 , H05K2203/166
摘要: For a substrate of a coil component, there are arranged a plurality of through-holes; the pattern-wiring is provided with a loop-shaped portion surrounding the circumference of a center hole which penetrates the substrate a pair of end portions which extend from that loop-shaped portion; and the neighboring two through-holes within the plurality of through-holes penetrate the substrate in a state that at least a part of each of the openings thereof superimpose each of the pair of end portions and is connected electrically with each of the end portions. In addition, the opening of one of the through-holes at one of the end portions within the pair of end portions is provided at a biased position close to the other of the end portions with respect to the center of the one of the end portions in the intersecting-direction.
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2.
公开(公告)号:US20190150271A1
公开(公告)日:2019-05-16
申请号:US16184571
申请日:2018-11-08
申请人: RAYTHEON COMPANY
发明人: Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
CPC分类号: H05K1/0218 , H01P3/08 , H01P11/003 , H05K1/0219 , H05K1/0221 , H05K1/0251 , H05K1/112 , H05K3/0044 , H05K3/107 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K2201/0707 , H05K2201/09036 , H05K2201/09545 , H05K2203/0228
摘要: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号:US10085345B2
公开(公告)日:2018-09-25
申请号:US14467079
申请日:2014-08-25
发明人: Risto Tuominen , Petteri Palm
IPC分类号: H01K1/18 , H01L23/538 , H05K1/18 , H01L23/552 , H01L23/00 , H01L25/10 , H01L25/00 , H01L23/544 , H05K1/02 , H05K3/46 , H01L23/29 , H05K3/28
CPC分类号: H05K1/189 , H01L23/295 , H01L23/5387 , H01L23/5389 , H01L23/544 , H01L23/552 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L25/105 , H01L25/50 , H01L2223/54426 , H01L2224/04105 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2224/82106 , H01L2224/82132 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01055 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/3025 , H01L2924/3511 , H05K1/0269 , H05K1/188 , H05K3/284 , H05K3/4611 , H05K2201/0355 , H05K2201/0367 , H05K2201/042 , H05K2201/056 , H05K2201/09918 , H05K2201/10674 , H05K2203/063 , H05K2203/166 , H01L2924/00
摘要: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.
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公开(公告)号:US20180263105A1
公开(公告)日:2018-09-13
申请号:US15914842
申请日:2018-03-07
发明人: Markus Leitgeb , Heinz Moitzi
CPC分类号: H05K1/0201 , H01L21/4857 , H01L23/5385 , H05K1/0271 , H05K1/0298 , H05K1/0366 , H05K1/0373 , H05K1/181 , H05K3/0061 , H05K3/4038 , H05K3/429 , H05K3/4608 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K3/4644 , H05K3/4673 , H05K3/4688 , H05K2201/0209 , H05K2201/096
摘要: A hybrid component carrier is manufactured by providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer; and forming a second layer structure on the first layer structure where the second layer structure includes at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements that is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure; and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.
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公开(公告)号:US10057990B2
公开(公告)日:2018-08-21
申请号:US15347632
申请日:2016-11-09
发明人: Kiyomi Muro , Chiari Shimizu
CPC分类号: H05K1/189 , G06F1/1633 , G06F1/1658 , H05K1/0216 , H05K1/0298 , H05K1/118 , H05K3/4611 , H05K2201/0723 , H05K2201/09145
摘要: According to one embodiment, a flexible printed circuit has a first circuit substrate and a second circuit substrate extending over the first circuit substrate. The first circuit substrate has a connector area. The second circuit substrate has an opening and an adhesive layer. The opening allows the connector area to be exposed. The opening has an opening edge which has a predetermined shape and defines the opening. The second circuit substrate has in the opening a depressed portion depressed deeper than the opening edge. Among various constituents of the second circuit substrate, at least the adhesive layer is depressed from the opening edge at the depressed portion.
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公开(公告)号:US09894765B2
公开(公告)日:2018-02-13
申请号:US15311601
申请日:2015-05-12
发明人: Kousuke Miura , Satoshi Kiya , Sumito Uehara
CPC分类号: H05K1/115 , H05K1/0313 , H05K1/034 , H05K1/09 , H05K3/381 , H05K3/4084 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K3/4661 , H05K2201/09509 , H05K2203/072
摘要: An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.
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公开(公告)号:US20180035546A1
公开(公告)日:2018-02-01
申请号:US15654801
申请日:2017-07-20
发明人: HIDETA ARAI , ATSUSHI MIKI , SATORU MORIOKA
CPC分类号: H05K3/0061 , H05K1/0203 , H05K1/0206 , H05K1/09 , H05K1/189 , H05K3/025 , H05K3/341 , H05K3/4611 , H05K3/4682 , H05K2201/0154 , H05K2201/0355 , H05K2201/10106 , H05K2203/0353
摘要: Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.
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公开(公告)号:US09847565B2
公开(公告)日:2017-12-19
申请号:US14930937
申请日:2015-11-03
CPC分类号: H01P1/20381 , H01P5/028 , H01P9/006 , H05K1/00 , H05K1/0219 , H05K1/0239 , H05K1/0298 , H05K3/4611 , H05K2201/097
摘要: The present disclosure relates to a tunable slow-wave transmission line. The tunable slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. The tunable slow-wave transmission line includes a first ground structure disposed along the undulating signal path. Further, the tunable slow-wave transmission line includes one or more circuits that may alter a signal transmitted in the tunable slow-wave transmission line so as to tune a frequency of the signal.
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公开(公告)号:US09844138B2
公开(公告)日:2017-12-12
申请号:US14933268
申请日:2015-11-05
发明人: Hiromichi Kitajima
IPC分类号: H04M1/00 , H05K1/11 , H01L23/498 , H01L23/50 , H05K3/46 , H01L23/66 , H04M1/02 , H05K1/02 , H05K1/09 , H05K3/24
CPC分类号: H05K1/116 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L2223/6666 , H01L2223/6677 , H01L2224/16225 , H01L2224/73204 , H01L2924/1305 , H01L2924/15311 , H04M1/0202 , H05K1/0298 , H05K1/09 , H05K1/113 , H05K1/114 , H05K3/244 , H05K3/4611 , H05K2201/09781 , H05K2201/10015 , H05K2201/1003 , H05K2201/10098 , H01L2924/00
摘要: A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A plating film is formed on the mounting electrodes with the reduced area. The mounting electrodes for connection to specific components are defined by first end surfaces of first via conductors, and hence, the areas of the mounting electrodes are significantly reduced, and the pitch between the mounting electrodes is significantly decreased. Also, the mounting electrodes defined by the first end surfaces of the first via conductors are connected to plane electrodes at end surfaces of second via conductors exposed from a surface of the multilayer body with internal wiring electrodes interposed therebetween. Thus, a plating film is able to be reliably provided on the mounting electrodes.
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10.
公开(公告)号:US20170292018A1
公开(公告)日:2017-10-12
申请号:US15511324
申请日:2014-12-10
发明人: YONGGUANG WU , Renzong Lin , Huangming Song
IPC分类号: C08L63/00 , C08G59/06 , C08G59/50 , C08G59/56 , C08G59/62 , H05K3/46 , C08J5/24 , C08J5/04 , C08J5/10 , B32B37/06 , B32B37/10 , B32B37/12 , C08G59/30 , C08G59/68
CPC分类号: C08L63/00 , B32B37/06 , B32B37/10 , B32B37/12 , B32B37/15 , B32B2038/168 , B32B2305/076 , B32B2305/18 , B32B2309/02 , B32B2311/12 , B32B2457/08 , C08G14/06 , C08G59/063 , C08G59/304 , C08G59/5046 , C08G59/56 , C08G59/621 , C08G59/686 , C08G59/688 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/00 , C08J2363/02 , C08J2363/08 , C08J2363/10 , C08L61/06 , C08L61/34 , C08L63/04 , C08L63/06 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/02 , C08L2205/05 , H05K1/0326 , H05K1/0353 , H05K3/4611 , H05K2201/012 , H05K2201/0209
摘要: A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.
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