公开(公告)号：US20090277274A1

公开(公告)日：2009-11-12

申请号：US12306201

申请日：2007-03-28

Applicant: Paul Edward Vickery ,  Aidrian Nowell

Inventor： Paul Edward Vickery ,  Aidrian Nowell

IPC: G01L11/04 ,  G01R3/00

CPC classification number: G01L9/0025 ,  G01L1/165 ,  G01L27/002 ,  Y10T29/4913

Abstract: A method of manufacturing a pressure monitoring package comprises the steps of mounting a plurality of resonators onto a substrate 1, mounting the substrate 1 in a package base 11, mechanically constraining the package base 11 within a mechanical preloading jig, and adjusting the preload using the jig whilst measuring the frequency of the SAWs until the required frequency is obtained. A lid 7 is then welded onto the package base 11 using a laser welder, after which the preload frequency of the package 10 is fine tuned by using the laser welder to produce laser marks 21-28, 31-38 on the outside of the package 10.

Abstract translation: 一种制造压力监测组件的方法包括以下步骤：将多个谐振器安装到基板1上，将基板1安装在封装基座11中，在机械预加载夹具内机械约束封装基座11，并且使用 夹具，同时测量SAW的频率，直到获得所需的频率。 然后使用激光焊接机将盖7焊接到封装基座11上，然后通过使用激光焊接机在封装的外部产生激光标记21-28,31-38-来微调封装10的预载频率 10。

公开(公告)号：US07798006B2

公开(公告)日：2010-09-21

申请号：US12306201

申请日：2007-03-28

Applicant: Paul Edward Vickery ,  Aidrian Nowell

Inventor： Paul Edward Vickery ,  Aidrian Nowell

IPC: G01L11/04

CPC classification number: G01L9/0025 ,  G01L1/165 ,  G01L27/002 ,  Y10T29/4913

Abstract: A method of manufacturing a pressure monitoring package comprises the steps of mounting a plurality of resonators onto a substrate 1, mounting the substrate 1 in a package base 11, mechanically constraining the package base 11 within a mechanical preloading jig, and adjusting the preload using the jig whilst measuring the frequency of the SAWs until the required frequency is obtained. A lid 7 is then welded onto the package base 11 using a laser welder, after which the preload frequency of the package 10 is fine tuned by using the laser welder to produce laser marks 21-28, 31-38 on the outside of the package 10.

Abstract translation: 一种制造压力监测组件的方法包括以下步骤：将多个谐振器安装到基板1上，将基板1安装在封装基座11中，在机械预加载夹具内机械约束封装基座11，并且使用 夹具，同时测量SAW的频率，直到获得所需的频率。 然后使用激光焊接机将盖7焊接到封装基座11上，然后通过使用激光焊接机在封装的外部产生激光标记21-28,31-38-来微调封装10的预载频率 10。