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    Method of sorting dice by speed during die bond assembly and packaging to customer order
    2.
    发明授权
    Method of sorting dice by speed during die bond assembly and packaging to customer order 有权
    在模具接合装配和包装到客户订单期间通过速度分选骰子的方法

    公开(公告)号：US06984533B1

    公开(公告)日：2006-01-10

    申请号：US09974552

    申请日：2001-10-09

    Applicant: Ramon R. Regos ,  Alelie T. Funcell

    Inventor： Ramon R. Regos ,  Alelie T. Funcell

    IPC: H01L21/66

    CPC classification number: H01L22/20 ,  H01L23/544 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: When integrated circuit dice are tested as part of a completely manufactured wafer, the individual die is tested both for proper function and for speed grade. A wafer map is formed in a computer to keep up with which dice on the wafer are good and to record the speed grade of each good die. This wafer map is then used during the step of dicing and packaging the wafer to fill existing orders by placing a die that meets a speed grade of an order into the package that has been ordered. More than one kind of order can be filled from dice in a single wafer. The method allows integrated circuit devices to be packaged to order and eliminates the need to keep an inventory of packaged dice.

    Abstract translation: 当集成电路芯片作为完全制造的晶片的一部分进行测试时，单独的芯片既可以正常工作又可用于速度等级。 在计算机中形成晶片图以跟上晶片上的哪个骰子是好的并且记录每个好模具的速度等级。 然后在切割和包装晶片的步骤中使用该晶片图，以便通过将满足订单的速度等级的模具放置到已经订购的封装中来填充现有的订单。 可以在单个晶片中从骰子中填充多种顺序。 该方法允许集成电路设备打包以订购并消除对包装骰子库存的需要。

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