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公开(公告)号：US4498345A
公开(公告)日：1985-02-12
申请号：US432619
申请日：1982-10-04
CPC分类号： G01M5/005 , B23D59/002 , B28D5/028 , G01N3/20 , Y10T83/855
摘要： A system for measuring the flexure of a saw blade in situ includes in one embodiment a non-contact displacement sensor and means for directing a fluid flow at the blade adjacent the sensor. The deflection of the blade by the fluid flow is detected by the sensor which generates a signal related to blade flexure. The system indicates when a saw blade is correctly tensioned or when retensioning is required.
摘要翻译： 用于测量锯片原位弯曲的系统包括在一个实施例中为非接触位移传感器和用于引导邻近传感器的叶片处的流体流动的装置。 通过流体流动的叶片的偏转由传感器检测，该传感器产生与叶片挠曲相关的信号。 系统指示锯片何时正确张紧或需要重新拉紧时。
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公开(公告)号：US6080042A
公开(公告)日：2000-06-27
申请号：US961815
申请日：1997-10-31
CPC分类号： B24B37/04
摘要： A wafer polishing apparatus includes one or more wafer carriers each containing one or more wafers mounted on both sides of the carrier. Upper and lower turntables having upper and lower polishing surfaces, rotate to polish the wafers attached to the carriers. Hence, wafers on the top of the carriers, and wafers on the bottom of the carriers are polished simultaneously. This configuration increases throughput; also, thermal deformations in the wafers are reduced, thus improving flatness.
摘要翻译： 晶片抛光装置包括一个或多个晶片载体，每个晶片载体包含安装在载体两侧的一个或多个晶片。 上下转盘具有上和下抛光表面，旋转以抛光附着于载体的晶片。 因此，载体顶部的晶片和载体底部的晶片被同时抛光。 此配置增加吞吐量; 此外，晶片中的热变形也减少，从而提高平坦度。
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公开(公告)号：US4501258A
公开(公告)日：1985-02-26
申请号：US432508
申请日：1982-10-04
CPC分类号： B23Q11/145 , B23D47/005 , B23D59/02 , B28D5/028
摘要： A system and method for reducing kerf loss and controlling the tension and lateral vibration of an internal diameter saw blade by controlling the temperature of the blade while it is still rotating. The blade temperature is controlled by regulating the temperature of the cutting fluid flow associated therewith. In one embodiment blade tension is periodically measured and, when the tension falls below a predetermined limit, the temperature of the cutting fluid stream is decreased for a period of time until the tension increases to a preselected value.
摘要翻译： 一种用于通过在叶片仍在旋转的同时控制叶片的温度来减小切口损失并控制内径锯片的张力和横向振动的系统和方法。 通过调节与其相关联的切削液流动的温度来控制刀片温度。 在一个实施例中，周期性地测量叶片张力，并且当张力低于预定极限时，切割流体流的温度降低一段时间，直到张力增加到预选值。
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