Apparatus for melting a solder by vapor-phase treatment
    1.
    发明授权
    Apparatus for melting a solder by vapor-phase treatment 失效
    用于通过气相处理熔化焊料的装置

    公开(公告)号:US4759710A

    公开(公告)日:1988-07-26

    申请号:US23682

    申请日:1987-03-09

    IPC分类号: B23K1/015 F27D19/00 F26B19/00

    CPC分类号: B23K1/015

    摘要: Apparatus for melting by vapor-phase treatment a solder applied to an object. The liquid serving for vapor production, which is situated in a vessel, is heated by electrical heating means which are disposed exclusively outside of the vessel and are completely enveloped by a liquid heat-carrying medium. The vessel floor is provided with projections to increase the thermal transfer. A tubing coil is furthermore disposed in the heat-carrying medium for rapid cooling thereof.

    摘要翻译: 用于通过气相处理将应用于物体的焊料熔化的装置。 位于容器中的用于蒸气产生的液体被电加热装置加热,该加热装置专门设置在容器外部,并被液体载热介质完全包封。 容器底板设有突起,以增加热传递。 此外,管线圈还设置在载热介质中用于其快速冷却。