Composition from reacting vinylidene terminated
polybutadiene/acrylonitrile and bisimide
    1.
    发明授权
    Composition from reacting vinylidene terminated polybutadiene/acrylonitrile and bisimide 失效
    亚乙烯基封端的聚丁二烯/丙烯腈与双酰亚胺的组合

    公开(公告)号:US5087681A

    公开(公告)日:1992-02-11

    申请号:US391667

    申请日:1989-08-08

    摘要: A novel method for preparing a thermosetting imide resin composition which consists of chemically reacting a liquid mixture of a carboxy-(CTBN) or vinylidene-(VTBN) polybutadiene/acrylonitrile and a co-reactant comprisinga. at least one N,N'-bisimide of an unsaturated carboxylic acid of general formula I ##STR1## wherein B represents a divalent radical containing a carbon-carbon double bond and A represents a divalent radical having at least two carbon atoms, orb. the imide resin reaction product of an least one N,N'-bisimide of general formula I and at least one primary organic diamine or organic hydrazide, orc. the imide resin reaction product of at least one N,N'-bisimide of general formula I, at least one monoimide, and at least one organic hydrazide,to yield a thermosetting imide resin composition containing copolymerized CTBN or VTBN and co-reactant. A resin composition prepared by this method may be cured at a temperature between 100.degree. C. and 350.degree. C. to yield a full cross-linked polyimide matrix containing a dispersion of phase-separated solid particles of copolymerized CTBN or VTBN and co-reactant.

    摘要翻译: 一种制备热固性酰亚胺树脂组合物的新方法,其通过使羧基(CTBN)或亚乙烯基 - (VTBN)聚丁二烯/丙烯腈的液体混合物与包含a-的共反应物进行化学反应而组成。 至少一种通式I的不饱和羧酸的N,N'-二酰亚胺其中B表示含有碳 - 碳双键的二价基团,A表示具有至少两个碳原子的二价基团,或b 。 或至少一种通式I的N,N'-二酰亚胺和至少一种主要的有机二胺或有机酰肼的酰亚胺树脂反应产物,或c。 至少一种通式I的N,N'-二酰亚胺,至少一种单酰亚胺和至少一种有机酰肼的酰亚胺树脂反应产物,得到含共聚CTBN或VTBN和共反应物的热固性酰亚胺树脂组合物。 通过该方法制备的树脂组合物可以在100℃和350℃之间的温度下固化,得到完整的交联聚酰亚胺基质,其含有共聚CTBN或VTBN的相分离固体颗粒的分散体和共反应物 。

    Curable thermosetting prepolymerised imide resin compositions
    2.
    发明授权
    Curable thermosetting prepolymerised imide resin compositions 失效
    可固化的热固性预聚酰亚胺树脂组合物

    公开(公告)号:US5153274A

    公开(公告)日:1992-10-06

    申请号:US510139

    申请日:1990-04-17

    IPC分类号: C08C19/36

    CPC分类号: C08C19/36

    摘要: Curable thermosetting prepolymerized imide resin compositions are prepared by chemically reacting, at a temperature below 150.degree. C., a liquid mixture of carboxy-terminated polybutadiene/acrylonitrile (CTBN) and a co-reactant comprising at least one N,N'-bisimide of an unsaturated carboxylic acid of formula (I) where B represents a divalent radical containing a carbon-carbon double bond and A represents a divalent radical having at least two carbon atoms to yield a curable thermosetting prepolymerized imide resin composition containing copolymerized CTBN and co-reactant. A resin composition prepared by this method may be cured at a temperature between 100.degree. C. and 350.degree. C. to yield a fully cross-linked polyimide matrix containing a dispersion of phase-separated solid particles of copolymerized CTBN and co-reactant, the matrix having a lapshear strength at 20.degree. C. at least 50% greater than that of a fully cross-linked polyimide cured from the co-reactant alone.

    摘要翻译: 通过在低于150℃的温度下将羧基封端的聚丁二烯/丙烯腈(CTBN)和共反应物的液体混合物与包含至少一种N,N'-二酰亚胺的共反应物进行化学反应来制备可固化的热固性预聚酰亚胺树脂组合物 式(I)的不饱和羧酸,其中B表示含有碳 - 碳双键的二价基团,A表示具有至少两个碳原子的二价基团,得到含有共聚CTBN和共反应物的可固化的热固性预聚酰亚胺树脂组合物 。 通过该方法制备的树脂组合物可以在100℃和350℃之间的温度下固化,得到完全交联的聚酰亚胺基质,其含有共聚CTBN和共反应物的相分离固体颗粒的分散体, 基质在20℃下具有比共聚反应物单独固化的完全交联的聚酰亚胺的至少50%的至少50%。

    Curable thermosetting prepolymerized imide resin compositions
    3.
    发明授权
    Curable thermosetting prepolymerized imide resin compositions 失效
    可固化的热固性预聚酰亚胺树脂组合物

    公开(公告)号:US4946907A

    公开(公告)日:1990-08-07

    申请号:US106998

    申请日:1987-10-05

    IPC分类号: C08C19/36

    CPC分类号: C08C19/36

    摘要: A curable thermosetting prepolymerized imide resin composition is prepared by chemically reacting, at a temperature below 150.degree. C., a liquid mixture of a carboxy-terminated polybutadiene/acrylonitrile (CTBN) and a co-reactant containing at least one N,N'-bisimide of an unsaturated carboxylic acid of general formula (I) ##STR1## where B represents a divalent radical containing a carbon-carbon double bond and A represents a divalent radical having at least two carbon atoms, at least one monoimide, and at least one organic hydrazide, to yield a curable thermosetting prepolymerized imide resin composition containing copolymerized CTBN and co-reactant. A resin composition prepared by this method may be cured at a temperature between 100.degree. C. and 350.degree. C. to yield a fully cross-linked polymimide matrix containing a dispersion of phase-separated solid particles of copolymerized CTBN and co-reagent, said matrix having a lap shear strength at 20.degree. C. at least 50% greater than that of a fully cross-linked polyimide cured from the co-reactant alone.

    摘要翻译: PCT No.PCT / GB83 / 00350 Sec。 371日期1984年8月21日 102(e)日期1984年8月21日PCT提交1983年12月23日PCT公布。 出版物WO84 / 02528 日本1984年7月5日。可固化的热固性预聚酰亚胺树脂组合物通过在低于150℃的温度下将羧基封端的聚丁二烯/丙烯腈(CTBN)和共反应物的液体混合物 至少一种通式(I)的不饱和羧酸的N,N'-二酰亚胺其中B表示含有碳 - 碳双键的二价基团,A表示具有至少两个碳原子的二价基团 ,至少一种单酰亚胺和至少一种有机酰肼,得到含有共聚CTBN和共反应物的可固化的热固性预聚酰亚胺树脂组合物。 通过该方法制备的树脂组合物可以在100℃和350℃之间的温度下固化,得到含有共聚CTBN和共试剂的相分离固体颗粒的分散体的完全交联的聚酰亚胺基体,所述 基体在20℃下的搭接剪切强度比单独的共反应物固化的完全交联的聚酰亚胺的基体的至少50%大。