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公开(公告)号：US5038198A
公开(公告)日：1991-08-06
申请号：US462544
申请日：1990-01-09
IPC分类号： A61K39/175 , C12N7/06 , H01L21/50 , H01L23/495 , H01L25/065
CPC分类号： H01L23/49575 , H01L21/50 , H01L25/0655 , H01L2924/0002 , Y10T29/4913 , Y10T29/49146
摘要： A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
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公开(公告)号：USRE38037E1
公开(公告)日：2003-03-18
申请号：US08184783
申请日：1994-01-21
IPC分类号： H01L23495
CPC分类号： H01L23/49575 , H01L21/50 , H01L25/0655 , H01L2924/0002 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
摘要翻译： 模块化半导体功率器件具有由氧化铝板构成的导电部件，铜层在相对侧被焊接。 将芯片焊接到这些层中的一个，并且这些层中的另一个依次被焊接到金属散热器。 芯片连接到相应的铜带上，铜条又被焊接到最初形成框架的一部分的热条上，使得在该装置被封装在合成树脂中之后，框架的连接构件可以被切除以免去 后者条的端部暴露。
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