摘要:
The invention relates to a process for modifying materials including, e.g., dielectric materials associated with electronic substrates, semiconductor chips, wafers, and the like, damaged by fabrication processes such as plasma etch processing. The described method improves structural integrity as measured, e.g., by Young's Modulus, as well as hydrophobicity, as measured, e.g., by contact angles at the liquid/surface interface.
摘要:
A method and apparatus are disclosed for measuring charged particle and photon coincident radiation. The method and apparatus measure radioisotopes having beta-gamma coincident spectroscopies, providing spectral resolution and efficency that improve calibration and maintenance characteristics as well as isotope identifying characteristics important in industrial, defense, security, and human health applications.