公开(公告)号：US07190802B2

公开(公告)日：2007-03-13

申请号：US10231733

申请日：2002-08-30

申请人： William A. Rains ,  Arun Mirchandani ,  Robert E. Shostak ,  Chris Wheaton

发明人： William A. Rains ,  Arun Mirchandani ,  Robert E. Shostak ,  Chris Wheaton

IPC分类号： H04R25/00

CPC分类号： H04R1/083

摘要： A microphone enclosure for reducing the intensity of sound waves that reach a microphone is presented. The enclosure may be a solid mass with a cavity, designed so that most of the microphone is surrounded by the solid mass when the microphone is inserted into the cavity. The solid mass is dense enough to reduce much of the sound waves that are first mechanically and then acoustically coupled with the microphone. The microphone may be inserted into the cavity so that a sound receiving section is exposed at the entrance of the cavity. Also, the microphone may not be inserted to the end of the cavity so that there is a space between the end of the cavity and the microphone. A hole may be located on the cavity sidewall so that sound can reach the microphone through this space. The sound receiving sections of the microphone are aligned with openings in the communications device.

摘要翻译： 提出了一种用于降低到达麦克风的声波强度的麦克风外壳。 外壳可以是具有空腔的固体块体，设计成使得当麦克风插入空腔时，大多数麦克风被固体块包围。 固体质量足够密实，以减少首先机械地再与麦克风声学耦合的大部分声波。 麦克风可以插入空腔中，使得声音接收部分在空腔的入口处露出。 此外，麦克风可能不会插入空腔的端部，使得在空腔的端部和麦克风之间存在空间。 孔可以位于空腔侧壁上，使得声音可以通过该空间到达麦克风。 麦克风的声音接收部分与通信设备中的开口对齐。