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公开(公告)号:US20220415854A1
公开(公告)日:2022-12-29
申请号:US17359481
申请日:2021-06-25
申请人: Georgios Dogiamis , Adel Elsherbini , Qiang Yu , Shawna Liff , Beomseok Choi
发明人: Georgios Dogiamis , Adel Elsherbini , Qiang Yu , Shawna Liff , Beomseok Choi
IPC分类号: H01L25/065 , H01L27/06 , H01L49/02 , H01L23/66
摘要: Apparatus and methods are disclosed. In one example, a semiconductor package includes a first die that has a first surface and a first electrical lead at or near the first surface. The semiconductor package also includes a substrate that has a second surface and is coupled to the first die at a first interface. The substrate also includes a first electrode at or near the second surface and at least a first portion of an integrated passive device that is coupled to the first electrode. The first electrode is aligned with and coupled to the first electrical lead across the first interface.