Method of forming openings in substrates and inkjet printheads fabricated thereby
    1.
    发明授权
    Method of forming openings in substrates and inkjet printheads fabricated thereby 有权
    在由此制造的基板和喷墨打印头中形成开口的方法

    公开(公告)号:US08043517B2

    公开(公告)日:2011-10-25

    申请号:US11229825

    申请日:2005-09-19

    IPC分类号: B41J2/16

    摘要: A method of forming an opening through a substrate includes defining an area on a first surface of the substrate where the opening is to be formed, the area having a center region flanked by edge regions. A top layer having a substantially closed space located over the area is formed on the first surface. Structure for promoting etching of the center region is provided, and the first surface of the substrate is etched in the area. In one embodiment, the method can fabricate an inkjet printhead having a substrate having an ink feed hole formed therethrough and an orifice plate formed thereon. A plurality of particle tolerance elements located over a center region of the ink feed hole promoted etching during the fabrication of the printhead.

    摘要翻译: 通过基板形成开口的方法包括限定在要形成开口的基板的第一表面上的区域,该区域具有侧面为边缘区域的中心区域。 在所述第一表面上形成有位于所述区域上方的基本封闭空间的顶层。 提供了用于促进中心区域的蚀刻的结构,并且在该区域中蚀刻基板的第一表面。 在一个实施例中,该方法可以制造具有基底的喷墨打印头,该基底具有形成在其上的供墨孔和形成在其上的孔板。 位于墨水供给孔的中心区域之上的多个颗粒公差元件在打印头的制造过程中促进蚀刻。