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    Transfer device for semiconductor wafers
    1.
    发明授权
    Transfer device for semiconductor wafers 有权
    半导体晶片传输装置

    公开(公告)号：US06431811B1

    公开(公告)日：2002-08-13

    申请号：US09508335

    申请日：2000-05-10

    Applicant: Jakob Blattner ,  Hans Schmid ,  Bernhard Strasser ,  Christian Balg

    Inventor： Jakob Blattner ,  Hans Schmid ,  Bernhard Strasser ,  Christian Balg

    IPC: B65G4907

    CPC classification number: H01L21/67313 ,  H01L21/67757 ,  H01L21/67781 ,  Y10S414/136

    Abstract: In order to achieve a higher compaction ratio with a wafer transfer apparatus for transferring wafers stacked in an interspaced manner in a first holding device, e.g. a magazine, to a second holding device, which has a carrier device which is provided with two rollers which are arranged parallel to one another and can each be rotated about its longitudinal axis, the rollers can be arranged in a plurality of rotational positions, each roller is provided with a plurality of wafer receptacles extending over at least part of their circumference, some of the receptacles are arranged offset both in the longitudinal direction and in the circumferential direction of the roller and are arranged in segment portions of the circumference of the roller which extend essentially parallel to the longitudinal axis of the respective roller, the proposal according to the invention is that in at least three segment portions (14, 15, 16, 17, 18, 19) there are receptacles (6) for wafers of in each case at least one wafer stack, at least a fourth segment portion (14-19) is formed, in which there are receptacles for the simultaneous arrangement of wafers of at least three wafer stacks, receptacles of different segment portions of the respective roller (2, 3) being offset both in the longitudinal direction of the roller (2, 3) and in the circumferential direction of the roller, and there being, in the at least fourth segment portion (14-19), receptacles which are essentially in alignment in the circumferential direction of the roller with receptacles (6) of the first three segment portions.

    Abstract translation: 为了通过晶片传送装置实现更高的压缩率，所述晶片传送装置用于将以间隔方式堆叠的晶片传送到第一保持装置，例如， 一个盒子，具有一个托架装置，该托架装置设置有彼此平行布置的两个辊子，每个辊子可绕其纵向轴线旋转，辊子可以布置成多个旋转位置，每个辊子 滚筒设置有多个在其圆周的至少一部分上延伸的晶片接收器，其中一些接收器沿辊的纵向方向和圆周方向布置，并且布置在辊的圆周的分段部分中 根据本发明的方案，在至少三个段部分（14,15,16,17,18,19）中存在用于晶片的插座（6） 每个壳体至少有一个晶片堆叠，形成至少第四段部分（14-19），其中存在用于同时布置至少三个晶片的晶片的插座 各个辊子（2,3）的不同段部分的容器在辊子（2,3）的纵向方向和辊子的圆周方向上都偏移，并且在至少第四个 分段部分（14-19），其在基本上在辊的圆周方向上对准的容器，其具有前三个段部分的容器（6）。

    Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container
    2.
    发明授权
    Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container 失效
    晶片夹持装置，其适于旋转从储存容器中的水平位置取出的晶片

    公开(公告)号：US6092971A

    公开(公告)日：2000-07-25

    申请号：US889150

    申请日：1997-07-07

    Applicant: Christian Balg ,  Bernhard Strasser ,  Jakob Blattner

    Inventor： Christian Balg ,  Bernhard Strasser ,  Jakob Blattner

    IPC: H01L21/687 ,  B65G65/00

    CPC classification number: H01L21/68707 ,  Y10S414/137 ,  Y10S414/138 ,  Y10S414/141

    Abstract: For removing and transporting several spaced, parallel wafers stored in a container, a gripping device is provided. The gripping device has a holding rake and several gripping heads which can be rotated with respect to the holding rake. In one swivel position, the gripping heads are moved through between the wafers and then swivelled into another swivel position. In this latter position, the gripping heads are brought to a stop against the edges of the wafers movement of the gripping device, and then the opposite edges of the wafer disks are brought to stop against the counterholder by displacement of the counterholder. All wafers contained in the container are thus simultaneously securely held and can be displaced out of the container. In order to then swivel the wafers, the holding rake which has slots for receiving the wafer edges is also stopped at the wafer edges, and the counterholder is then pushed back. The wafers are therefore securely swivelled. In the swivelled position, the vertically standing wafers are supplied to a processing carrier.

    Abstract translation: 为了移除和运输存储在容器中的几个间隔开的平行晶片，提供了夹持装置。 夹持装置具有保持耙和可相对于保持耙转动的多个夹头。 在一个旋转位置中，夹持头移动通过晶片之间，然后旋转到另一个旋转位置。 在后一位置，夹持头抵靠夹持装置的晶片移动的边缘停止，然后通过倒档器的移位使晶片盘的相对边缘停止在柜台上。 因此，容纳在容器中的所有晶片同时牢固地保持并且可以从容器中移出。 为了使晶片旋转，具有用于接收晶片边缘的槽的保持耙也停止在晶片边缘处，然后将反向夹推回。 因此，晶片被可靠地旋转。 在旋转位置，垂直放置的晶片被提供给处理载体。

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