Abstract:
By adding light reflective and/or transparent and/or translucent material within a micro-electronic circuit housing, improved light transfer is achieved between a light generation source and a light utilization device. In one embodiment, the reflective material is placed on the inside surface of a non-metallic housing lid and the light from the light source (typically an LED) reflects from the reflective material and impacts the device (typically an FET). In another embodiment, the LED and FET are encased in a clear (low light-loss) material (typically silicone overcoat) so as to allow the light from the LED to reflect from the top of the clear material onto the FET. If desired, an opaque encapsulant surrounds the clear material and fills out the volume within the housing. In another embodiment, clear or translucent (as opposed to opaque) encapsulant can be used to serve dual purpose as both the structural (volume filling, defined package share/outline) agent as well as to permit the internal light transmission and reflections to illuminate the device.
Abstract:
A carpet includes a weft fill material (18c) which fills the loops formed in the pile of warp yarns (14a and 14b) so as to be partially visible to contribute to both the design and appearance of the resultant carpet and the durability by supporting the inside of the loops formed by the warp yarns (14a and 14b). The binding chains (17a and 17b), with the wefts (18a and 18b), bind the pile warp yarns (14a and 14b) to the carpet backing with the stuffer (16) being held securely between the wefts (18a and 18b) . In alternative embodiments the binding chains (17a and 17b) can be partially or totally omitted with the warp yarns (14a and 14b) being fed over and under the stuffer (16). Apparatus for forming the carpet is described.
Abstract:
A system for the formation of a thick robust transparent floor finish layer from a high solids formulation with an applicator device utilizing micro fiber technology. A micro fiber applicator device can be configured to apply a sufficient amount of an aqueous high solids floor finish to obtain a thick robust finish layer in a single application. One system for applying the floor finish can comprise a source of aqueous floor finish and an applicator wand comprising an application nozzle and application surface. Application surface can comprise micro fiber technology in a pad structure comprising a reservoir foam and a micro fiber applicator surface.
Abstract:
The present invention includes a system for applying floor finish. The system can include a back or other pack configured to hold one or more containers of liquid floor finish, a wand applicator, and metering valve. The wand applicator can include handle and conduit. The conduit can provide fluid communication of floor finish from the container to a floor. The metering valve can be configured to controllably provide fluid communication of floor finish through the conduit and to release floor finish onto the floor. In an embodiment the system also includes a cleanout coupler. In an embodiment the system also includes a filter configured to filter the floor finish. In an embodiment, the backpack includes a grip configured for carrying the backpack. In an embodiment, the backpack includes positioning portion or surface configured to support portions of the container. In an embodiment, the backpack includes padded attachment apparatus configured to support the backpack on a wearer. The system can also include a refill station.
Abstract:
The present invention includes a system for applying floor finish. The system can include a back or other pack configured to hold one or more containers of liquid floor finish, a wand applicator, and metering valve. The wand applicator can include handle and conduit. The conduit can provide fluid communication of floor finish from the container to a floor. The metering valve can be configured to controllably provide fluid communication of floor finish through the conduit and to release floor finish onto the floor. In an embodiment the system also includes a cleanout coupler. In an embodiment the system also includes a filter configured to filter the floor finish. In an embodiment, the backpack includes a grip configured for carrying the backpack. In an embodiment, the backpack includes positioning portion or surface configured to support portions of the container. In an embodiment, the backpack includes padded attachment apparatus configured to support the backpack on a wearer.
Abstract:
By adding light reflective and/or transparent and/or translucent material within a micro-electronic circuit housing, improved light transfer is achieved between a light generation source and a light utilization device. In one embodiment, the reflective material is placed on the inside surface of a non-metallic housing lid and the light from the light source (typically an LED) reflects from the reflective material and impacts the device (typically an FET). In another embodiment, the LED and FET are encased in a clear (low light-loss) material (typically silicone overcoat) so as to allow the light from the LED to reflect from the top of the clear material onto the FET. If desired, an opaque encapsulant surrounds the clear material and fills out the volume within the housing. In another embodiment, clear or translucent (as opposed to opaque) encapsulant can be used to serve dual purpose as both the structural (volume filling, defined package share/outline) agent as well as to permit the internal light transmission and reflections to illuminate the device.
Abstract:
The present invention includes a system for applying floor finish. The system can include a back or other pack configured to hold one or more containers of liquid floor finish, a wand applicator, and metering valve. The wand applicator can include handle and conduit. The conduit can provide fluid communication of floor finish from the container to a floor. The metering valve can be configured to controllably provide fluid communication of floor finish through the conduit and to release floor finish onto the floor. In an embodiment the system also includes a cleanout coupler. In an embodiment the system also includes a filter configured to filter the floor finish. In an embodiment, the backpack includes a grip configured for carrying the backpack. In an embodiment, the backpack includes positioning portion or surface configured to support portions of the container. In an embodiment, the backpack includes padded attachment apparatus configured to support the backpack on a wearer. The system can also include a refill station.