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公开(公告)号:US06833995B1
公开(公告)日:2004-12-21
申请号:US09990121
申请日:2001-11-21
IPC分类号: H05K716
CPC分类号: G11B33/126 , G06F1/20 , G11B33/128 , H05K7/1425 , H05K7/1445
摘要: An enclosure is disclosed for housing multiple electronic devices. In one embodiment, the enclosure includes a chassis having a floor and opposing sidewalls. Discrete first and second midplanes, each having an opening formed therein, may be disposed in an interior portion of the chassis on opposite sides of a divider wall. The first and second midplanes may be configured to mate to at least one air displacement unit on a back surface of the associated midplane and to mate to at least one device sled on a front surface of the associated midplane. An opening is formed in each midplane adjacent the associated air displacement unit to permit air to pass through the opening.
摘要翻译: 公开了一种用于容纳多个电子设备的外壳。 在一个实施例中,外壳包括具有底板和相对侧壁的底架。 具有形成在其中的开口的分立的第一和第二中间板可以设置在分隔壁的相对侧上的底盘的内部。 第一和第二中间板可被配置为与相关联的中平面的背面上的至少一个空气排量单元配合,并且与相关联的中平面的前表面上的至少一个装置配合。 在相邻的空气排放单元附近的每个中平面中形成开口以允许空气通过开口。
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公开(公告)号:USD523003S1
公开(公告)日:2006-06-13
申请号:US29236809
申请日:2005-08-23
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公开(公告)号:USD547749S1
公开(公告)日:2007-07-31
申请号:US29236841
申请日:2005-08-24
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公开(公告)号:USD508691S1
公开(公告)日:2005-08-23
申请号:US29211321
申请日:2004-08-12
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