摘要:
An integrated circuit (300/400) includes first and second power domains and a bank of input/output (I/O) cells (305/405) coupled to the first and second power domains. The bank of I/O cells (305/405) includes a first plurality of active clamps (374/445) for the first power domain and a second plurality of active clamps (384/425) for the second power domain wherein the first (374/445) and second (384/425) pluralities of active clamps overlap along the bank of I/O cells. According to one aspect each of the plurality of input/output cells (420, 440) has a bonding pad (421, 441) for receiving an output signal referenced to a respective first power domain, and at least one ESD protection element (425, 445) for a respective second power domain. According to another aspect, each of the plurality of input/output cells (420, 440) has a bonding pad (421, 441) for receiving a respective output signal and at least one ESD protection element for each of a first power domain and a second power domain.