摘要:
A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
摘要:
A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.
摘要:
A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.