公开(公告)号：US20130248161A1

公开(公告)日：2013-09-26

申请号：US13537263

申请日：2012-06-29

申请人： PEI-CHUN KO ,  CHUN-SHENG YU ,  WEI-DE WANG ,  CHIH-SHENG HSIEH ,  CHUNG-JEN HUNG ,  GIN-ZEN TING ,  WEN-CHIEH WANG

发明人： PEI-CHUN KO ,  CHUN-SHENG YU ,  WEI-DE WANG ,  CHIH-SHENG HSIEH ,  CHUNG-JEN HUNG ,  GIN-ZEN TING ,  WEN-CHIEH WANG

IPC分类号： F28F1/20

CPC分类号： F28D15/0275 ,  F28D20/02 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y02E60/145 ,  H01L2924/00

摘要： A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes.

摘要翻译： 散热模块包括散热器。 多个凹槽限定在散热器的底表面中，热管容纳在散热器的每个凹槽中，并且由相变材料制成的导热垫粘附到散热器的底表面以覆盖 槽和热管。 导热垫是环境室温下的固体材料。 当加热到高于导热垫的转变温度的温度时，导热垫软化以填充导热垫，散热器和热管之间的空间。