公开(公告)号：US20070003737A1

公开(公告)日：2007-01-04

申请号：US11173608

申请日：2005-06-30

申请人： Rami Khalaf ,  Ebrahim Andideh ,  Caroline Merrill

发明人： Rami Khalaf ,  Ebrahim Andideh ,  Caroline Merrill

IPC分类号： B32B3/00

CPC分类号： H01R13/03 ,  B82Y10/00 ,  G11C13/0014 ,  G11C13/0016 ,  Y10T428/24612

摘要： Polymer electronics devices having reliable electrical contacts and methods of their fabrication are described. A surface of a conductive layer is modified, and a layer of polymer is formed on a modified surface of the conductive layer to create an electrical contact between the conductive layer and the layer of polymer. The electrical contact is created without adding an adhesion promoter. Modifying the surface of the conductive layer increases surface area of conductive layer and therefore improves polymer to conductive layer adhesion while preserving an original chemistry of the surface of the conductive layer. The modified surface of the conductive layer may be formed by mechanical roughening, chemical roughening, or both. The conductive layer forming the electrical contact to the polymer includes a noble metal. The polymer may be spin coated over the modified surface of the conductive layer.

摘要翻译： 描述了具有可靠电接触的聚合物电子器件及其制造方法。 导电层的表面被改性，并且在导电层的改性表面上形成聚合物层，以在导电层和聚合物层之间产生电接触。 在不添加粘合促进剂的情况下产生电接触。 改进导电层的表面增加了导电层的表面积，因此改善了聚合物与导电层的粘合性，同时保持了导电层表面的原始化学性质。 导电层的改性表面可以通过机械粗糙化，化学粗糙化或两者形成。 形成与聚合物的电接触的导电层包括贵金属。 聚合物可以旋涂在导电层的改性表面上。